# US 2021/0280503 A1 · Module > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2021/0280503 A1 - Document ID: US20210280503A1 - Status: Published application - Kind: A1 - Application number: 17/327,821 - Filed: 2021-05-24 - Published: 2021-09-09 - Earliest claimed: 2018-11-30 - Assignees: Murata Manufacturing Co., Ltd. - Applicants: Murata Manufacturing Co., Ltd. - Inventors: Kazushige SATO; Masayoshi TAKAGI - Web page: https://patentgrep.com/patent/US20210280503A1 ## CPC - H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons - H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts} - H10W 42/276: {the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation} - H10W 42/60: protecting against electrostatic charges or discharges, e.g. Faraday shields (integrated devices comprising arrangements for electrical protection H10D89/60) - H10W 70/685: comprising multiple insulating layers - H10W 74/114: {by a substrate and the encapsulations} - H10W 74/141: {the encapsulations being on at least the sidewalls of the semiconductor body} - H10W 90/00: Package configurations - H10W 42/271: {the arrangements being between stacked chips} - H10W 72/0198: {batch processes} - H10W 72/252: {comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu} - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 90/22: the stacked chips being on both top and bottom sides of a package substrate, interposer or RDL - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A module includes: a substrate including a first main surface; a first component mounted on the first main surface; a first land electrode provided on the first main surface; a first mold resin that covers at least the first main surface and the first component; a top surface shield film that covers a top surface of the first mold resin; a side surface shield film that covers a side surface of the first mold resin; a first conductor pillar provided in the first mold resin to electrically connect the first land electrode and the top surface shield film; and an upper first bypass conductor provided in the first mold resin to electrically connect the top surface shield film and the side surface shield film. ## Claims ### Claim 1 A module comprising: a substrate including a first main surface; a first component mounted on the first main surface; a first land electrode on the first main surface; a first mold resin that covers at least the first main surface and the first component; a top surface shield film that covers a top surface of the first mold resin; a side surface shield film that covers a side surface of the first mold resin; a first conductor pillar in the first mold resin to electrically connect the first land electrode and the top surface shield film; and an upper first bypass conductor in the first mold resin to electrically connect the top surface shield film and the side surface shield film. ### Claim 2 (depends on 1) The module according to claim 1, further comprising an upper second bypass conductor in the first mold resin to connect the first land electrode and the side surface shield film. ### Claim 3 (depends on 2) The module according to claim 2, wherein the upper first bypass conductor and the upper second bypass conductor are integrally provided. ### Claim 4 (depends on 1) The module according to claim 1, wherein the substrate includes a second main surface on an opposite side of the first main surface; the module further includes: a second component mounted on the second main surface; a second land electrode on the second main surface; a second mold resin that covers at least the second main surface and the second component; a bottom land electrode on a bottom surface of the second mold resin; and a second conductor pillar in the second mold resin to electrically connect the second land electrode and the bottom land electrode; the side surface shield film covers a side surface of the substrate and a side surface of the second mold resin; and the module further includes a lower bypass conductor in the second mold resin to electrically connect the bottom land electrode and the side surface shield film. ### Claim 5 A module comprising: a substrate including a first main surface and a second main surface that faces opposite to the first main surface; a first component mounted on the first main surface; a first mold resin that covers at least the first main surface and the first component; a second component mounted on the second main surface; a substrate land electrode on the second main surface; a second mold resin that covers at least the second main surface and the second component; a top surface shield film that covers a top surface of the first mold resin; a side surface shield film that covers a side surface of the first mold resin, a side surface of the substrate, and a side surface of the second mold resin; a bottom land electrode on a bottom surface of the second mold resin; a conductor pillar in the second mold resin to electrically connect the substrate land electrode and the bottom land electrode; and a lower bypass conductor in the second mold resin to electrically connect the bottom land electrode and the side surface shield film. ### Claim 6 (depends on 1) The module according to claim 1, wherein at least one solder ball or solder bump is provided on the first main surface. ### Claim 7 (depends on 1) The module according to claim 1, wherein the substrate is a multilayer substrate that includes internal conductor patterns. ### Claim 8 (depends on 1) The module according to claim 1, wherein the substrate is a resin multilayer substrate or a ceramic multilayer substrate. ### Claim 9 (depends on 1) The module according to claim 1, wherein the substrate includes an internal ground electrode that is electrically connected to the side surface shield film. ### Claim 10 (depends on 1) The module according to claim 1, wherein the first component is a power amplifier, a low noise amplifier, a switching integrated circuit, a high-frequency integrated circuit, a baseband integrated circuit, or a surface acoustic wave filter. ### Claim 11 (depends on 1) The module according to claim 1, wherein the first component is solder mounted or wire-bond mounted on the first main surface. ### Claim 12 (depends on 4) The module according to claim 4, wherein the second component is a surface mount device. ### Claim 13 (depends on 1) The module according to claim 1, wherein the upper first bypass conductor has a plate shape. ### Claim 14 (depends on 1) The module according to claim 1, wherein the upper first bypass conductor is spaced apart from the first main surface. ### Claim 15 (depends on 1) The module according to claim 1, wherein a distance between the first component and the upper first bypass conductor is shorter than a distance between the first component and either of the top surface shield film and the side surface shield film.