Mold flow balancing for a matrix leadframe

A packaged integrated circuit, comprising:

• a leadframe including:
• a die pad;
• a plurality of leads;
• and
• a plurality of tie bars connected to and extending from the die pad;
• wherein each tie bar includes an internal tie bar portion, and wherein the internal tie bar portion of at least one one tie bar of said plurality of tie bars includes a bend which is out of a plane coinciding with an upper surface of the tie bars, said bend forming a bent portion such that there is an obtuse angle between an upper surface of said bent portion and the upper surface of the die pad to form a mold flow control structure;
• an integrated circuit chip mounted to the upper surface of the die pad;
• electrical connections between the integrated circuit chip and the leads;
• and
• a molded package encapsulating the die pad, the integrated circuit chip, the electrical connections, internal portions of said leads and said bent portion of said one tie bar of said plurality of tie bars.

A method, comprising:

• installing a frame in a two part mold which includes a plurality of mold cavities, wherein the frame comprises:
• a plurality of leadframe units arranged in a matrix, wherein each leadframe unit comprises:
• a die pad;
• and a plurality of tie bars connected to and extending from the die pad, wherein each tie bar includes an internal tie bar portion and an external tie bar portion, and wherein the internal tie bar portion of at least one one tie bar of said plurality of tie bars includes a cut separating a part of said internal tie bar portion from the external tie bar portion, and wherein said part includes a bend which is out of a plane coinciding with an upper surface of the tie bars to form a mold flow control structure;
• and
• simultaneously injecting a molding compound into each mold cavity with the mold flow control structures of the leadframe units balancing mold flow among the plurality of mold cavities.