# US 2021/0280501 A1 · Pressurized semiconductor package and method of manufacturing the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2021/0280501 A1 - Document ID: US20210280501A1 - Status: Published application - Kind: A1 - Application number: 17/068,808 - Filed: 2020-10-12 - Published: 2021-09-09 - Earliest claimed: 2020-03-03 - Assignees: JMJ Korea Co., Ltd. - Applicants: JMJ Korea Co., Ltd. - Inventors: Yun Hwa CHOI; Jeonghun CHO - Web page: https://patentgrep.com/patent/US20210280501A1 ## CPC - H10W 70/466: {Tape carriers or flat leads} - H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts} - H10W 42/00: Arrangements for protection of devices (arrangements for thermal protection H10W40/00) - H10W 70/04: of leadframes - H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) - H10W 72/00: Interconnections or connectors in packages - H10W 76/12: characterised by their shape - H10W 90/00: Package configurations - H10W 90/811: {Multiple chips on leadframes} - H10W 20/032: {of conductive barrier, adhesion or liner layers} - H10W 72/073: {of die-attach connectors} - H10W 72/325: {Die-attach connectors having a filler embedded in a matrix} - H10W 72/352: {comprising metals or metalloids, e.g. solders} - H10W 72/354: {comprising polymers} - H10W 72/874: {On different surfaces} - H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract Provided is a pressurized semiconductor package including a lead frame including a pad board and a first terminal, a semiconductor chip, pressurizing members stacked to pressurize the semiconductor chip, and a package housing. The semiconductor chip is physically pressurized by the pressurizing members and is electrically connected to improve durability of the semiconductor package and to simplify a manufacturing process. ## Claims ### Claim 1 A pressurized semiconductor package comprising: a lead frame comprising at least one pad board and at least one first terminal formed on the pad board; at least one semiconductor chip placed on the lead frame; at least one pressurizing member stacked on the semiconductor chip to pressurize the semiconductor chip so as to electrically connect the first terminals to the semiconductor chips; and a package housing formed on the pad boards to protect the semiconductor chips. ### Claim 2 (depends on 1) The pressurized semiconductor package of claim 1, wherein the lead frame comprises a conductive adhesive or a non-conductive adhesive to attach the pad boards to the first terminals. ### Claim 3 (depends on 1) The pressurized semiconductor package of claim 1, wherein the first terminals are attached to the pad boards by using connection members. ### Claim 4 (depends on 1) The pressurized semiconductor package of claim 1, wherein in the lead frame, the first terminals are attached to the pad boards by ultrasonic welding or laser welding. ### Claim 5 (depends on 1) The pressurized semiconductor package of claim 1, wherein the pressurizing members apply pressure to the semiconductor chips so as to electrically connect the first terminals to the semiconductor chips without using a separate adhesive and to allow the semiconductor chips to normally operate, and the pressurizing members remove pressure applied to the semiconductor chips so as to release electrical connection between the first terminals and the semiconductor chips and to allow the semiconductor chips not to normally operate. ### Claim 6 (depends on 1) The pressurized semiconductor package of claim 1, wherein the pressurizing members comprise a first pressurizing member disposed on the semiconductor chips to pressurize the semiconductor chips, and at least one additional pressurizing member additionally pressurizing the first pressurizing member to electrically connect the semiconductor chips. ### Claim 7 (depends on 1) The pressurized semiconductor package of claim 1, wherein the semiconductor chips are placed on one end of the first terminals or the pad boards of the lead frame. ### Claim 8 (depends on 7) The pressurized semiconductor package of claim 7, wherein the semiconductor chips are attached to the lead frame by using a conductive adhesive or a non-conductive adhesive or by pressure applied from the pressurizing members without using a separate adhesive. ### Claim 9 (depends on 1) The pressurized semiconductor package of claim 1, wherein the first terminals are bent in a vertical direction from the pad area, and the pressurizing members comprise a first pressurizing member comprising a pressurizing unit which elastically pressurizes the upper part of the semiconductor chip, and a second terminal which is connected to the pressurizing unit, fixed on the pad board, and bent in a vertical direction. ### Claim 10 (depends on 9) The pressurized semiconductor package of claim 9, wherein the pressurizing members further comprise a second pressurizing member stacked on the upper part of the pressurizing unit of the first pressurizing member, fixed on the pad board, and additionally pressurizing in a direction crossing the pressurizing unit. ### Claim 11 (depends on 10) The pressurized semiconductor package of claim 10, wherein the pressurizing members further comprise a third pressurizing member which penetrates the second pressurizing member and additionally pressurizes the pressurizing unit of the first pressurizing member toward the semiconductor chip. ### Claim 12 A method of manufacturing a pressurized semiconductor package, the method comprising: preparing a lead frame comprising at least one pad board and at least one first terminal formed on the pad board; placing at least one semiconductor chip on the lead frame; stacking at least one pressurizing member on the semiconductor chip to pressurize the semiconductor chip so as to electrically connect the first terminals to the semiconductor chips; and forming a package housing formed on the pad boards to protect the semiconductor chips. ### Claim 13 (depends on 12) The method of claim 12, wherein the pressurizing members apply pressure to the semiconductor chips so as to electrically connect the first terminals to the semiconductor chips without using a separate adhesive and to allow the semiconductor chips to normally operate, and the pressurizing members remove pressure applied to the semiconductor chips so as to release electrical connection between the first terminals and the semiconductor chips and to allow the semiconductor chips not to normally operate. ### Claim 14 (depends on 12) The method of claim 12, wherein the pressurizing members comprise a first pressurizing member disposed on the semiconductor chips to pressurize the semiconductor chips, and at least one additional pressurizing member additionally pressurizing the first pressurizing member to electrically connect the semiconductor chips. ### Claim 15 (depends on 12) The method of claim 12, wherein the semiconductor chips are attached to the lead frame by using pressure applied from the pressurizing members without using a separate adhesive. ### Claim 16 (depends on 12) The method of claim 12, wherein the first terminals are bent in a vertical direction from the pad area, and the pressurizing members comprise a first pressurizing member comprising a pressurizing unit which elastically pressurizes the upper part of the semiconductor chip, and a second terminal which is connected to the pressurizing unit, fixed on the pad board, and bent in a vertical direction. ### Claim 17 (depends on 16) The method of claim 16, wherein the pressurizing members further comprise a second pressurizing member stacked on the upper part of the pressurizing unit of the first pressurizing member, fixed on the pad board, and additionally pressurizing in a direction crossing the pressurizing unit. ### Claim 18 (depends on 17) The method of claim 17, wherein the pressurizing members further comprise a third pressurizing member which penetrates the second pressurizing member and additionally pressurizes the pressurizing unit of the first pressurizing member toward the semiconductor chip. ### Claim 19 (depends on 1) The pressurized semiconductor package of claim 1, wherein the first terminals are bent in a vertical direction from the pad board and are bent in an inner direction or an outer direction of the package housing to finally form the pressurized semiconductor package. ### Claim 20 (depends on 12) The method of claim 12, wherein the first terminals are bent in a vertical direction from the pad board and are bent in an inner direction or an outer direction of the package housing to finally form the pressurized semiconductor package.