# US 2021/0280495 A1 · Methods of forming flexure based cooling solutions for package structures > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2021/0280495 A1 - Document ID: US20210280495A1 - Status: Published application - Kind: A1 - Application number: 16/328,614 - Filed: 2016-09-29 - Published: 2021-09-09 - Earliest claimed: 2016-09-29 - Assignees: Intel Corporation - Applicants: Intel Corporation - Inventors: Siddarth Kumar; Shubhada H. Sahasrabudhe; Sandeep B. Sane; Shalabh Tandon - Web page: https://patentgrep.com/patent/US20210280495A1 ## CPC - H10W 40/22: characterised by their shape, e.g. having conical or cylindrical projections - H10W 40/611: {Bolts or screws} - H10W 40/037: {Assembling together parts thereof} - H10W 40/73: for cooling by change of state - H10W 90/00: Package configurations - H10W 99/00: Subject matter not provided for in other groups of this subclass - H10W 40/231: {characterised by their places of attachment or cooling paths} - H10W 40/242: {comprising thermal conductors between chips and the and the arrangements for cooling, e.g. compliant heat-spreaders} - H10W 40/60: Securing means for detachable heating or cooling arrangements, e.g. clamps - H10W 72/877: {Bump connectors and die-attach connectors} - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract Methods/structures of joining package structures are described. Those methods/structures may include a first side of a die disposed on a first side of a substrate, and a cooling structure on a second side of the die, wherein the cooling structure comprises a first section attached to the substrate, and a second section disposed on a second side of the die, wherein the first and second sections are separated by an opening in the cooling structure. The opening surrounds a portion of the second section, and at least one flexure beam structure connects the first and second sections. ## Claims ### Claim at position 1 1-25. (canceled) ### Claim 26 A microelectronic package structure comprising: a first side of a die disposed on a substrate; a cooling structure disposed on a second side of the die, wherein the cooling structure comprises: a first section and a second section; a first opening adjacent a first edge of the second section; and a second opening adjacent a second edge of the second section, wherein the second section is disposed between the first opening and the second opening, and wherein the first section is disposed on an outer edge the first and second openings, wherein at least one flexure beam structure extends between the first and the second sections. ### Claim 27 (depends on 26) The microelectronic package structure of claim 26, wherein the cooling structure comprises an integrated heat spreader. ### Claim 28 (depends on 26) The microelectronic package structure of claim 26, wherein the first section of the cooling structure comprises at least one attachment portion. ### Claim 29 (depends on 28) The microelectronic package structure of claim 28, wherein the at least one attachment portion comprises a fastener, and wherein the fastener is connected to a top surface of a motherboard. ### Claim 30 (depends on 26) The microelectronic package structure of claim 26, further comprising a second die on the substrate, wherein the cooling structure further comprises a third portion disposed between third and fourth openings, wherein additional flexure beam structures are disposed between the third portion and the first portion. ### Claim 31 (depends on 26) The microelectronic package structure of claim 26, wherein the at least one flexure beam structure comprises a plurality of flexure beam structures on a first side of the second section and a plurality of flexure beam structures on a second side of the second section. ### Claim 32 (depends on 26) The microelectronic package structure of claim 26, wherein the at least one flexure beam structure comprises a curved flexure beam structure. ### Claim 33 (depends on 26) The microelectronic package structure of claim 26, wherein the at least one flexure beam structure comprises a first, a second and a third flexure beam structure, wherein the first, second and third flexure beam structures comprise about a 120 degree separation from each other around an edge of the second section. ### Claim 34 A microelectronic package structure comprising: a first side of a die on a first side of a substrate; a cooling structure on a second side of the die, wherein the cooling structure comprises: a first portion attached to the substrate; and a second portion disposed on a second side of the die, wherein the first and second portions are separated by an opening in the cooling structure, wherein the opening surrounds a portion of the second portion, and wherein at least one flexure beam structure connects the first and second portions. ### Claim 35 (depends on 34) The microelectronic package structure of claim 34, wherein the cooling structure comprises copper. ### Claim 36 (depends on 34) The microelectronic package structure of claim 34, wherein the first portion comprises an attachment portion capable of receiving a fastener to attach to the substrate. ### Claim 37 (depends on 34) The microelectronic package structure of claim 34, wherein a heat sink is disposed on a top surface of the cooling structure. ### Claim 38 (depends on 34) The microelectronic package structure of claim 34, wherein the substrate comprises a motherboard. ### Claim 39 (depends on 34) The microelectronic package structure of claim 34, wherein the die comprises a portion of a bare die package. ### Claim 40 (depends on 34) The microelectronic package structure of claim 34, wherein the microelectronic package structure comprises a portion of a multi die package. ### Claim 41 (depends on 34) The device structure of claim 34, wherein the cooling structure comprises one of a cold plate or an integrated heat spreader. ### Claim 42 A method of forming a microelectronic package structure, comprising: placing a cooling structure on a die disposed on a substrate, wherein the cooling structure comprises: a first portion disposed over a portion of the substrate adjacent the die; a second portion disposed on a back side of the die, wherein the first and second portions are separated by an opening in the cooling structure, wherein the opening surrounds a portion of the second portion, and wherein at least one flexure structure connects the first and second portions; and attaching the cooling structure to the substrate, wherein the at least one flexure beam structure decouples a load strain from the first portion and the second portion. ### Claim 43 (depends on 42) The method of claim 42, further comprising wherein the cooling structure comprises one of a heat spreader or a cold plate. ### Claim 44 (depends on 42) The method of claim 42, wherein the load force components are distributed away from the die through a flexing motion of the flexure beam structure. ### Claim 45 (depends on 42) The method of claim 42, further comprising wherein the flexure beam structure comprises a curved structure. ### Claim 46 (depends on 42) The method of claim 42, wherein a heat sink is attached to the cooling structure, and wherein the cooling structure deflects the load of the attached heat sink. ### Claim 47 (depends on 42) The method of claim 42, further comprising wherein the cooling structure comprises copper. ### Claim 48 (depends on 42) The method of claim 42, further comprising a heat pipe coupled to the cooling structure. ### Claim 49 (depends on 42) The method of claim 42, further comprising wherein the first portion comprises attachment portions to receive fasteners for fastening the first portion to the substrate. ### Claim 50 (depends on 42) The method of claim 42, wherein the substrate comprises a motherboard.