# US 2021/0280494 A1 · Accordion heat sink

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 2021/0280494 A1
- Document ID: US20210280494A1
- Status: Published application
- Kind: A1
- Application number: 17/174,565
- Filed: 2021-02-12
- Published: 2021-09-09
- Earliest claimed: 2020-03-06
- Assignees: ARRIS Enterprises LLC
- Applicants: ARRIS Enterprises LLC
- Inventors: Ryan BAKER
- Web page: https://patentgrep.com/patent/US20210280494A1

## CPC

- H10W 40/226: {characterised by projecting parts, e.g. fins to increase surface area (leadframes for cooling H10W70/461)}
- H10W 40/60: Securing means for detachable heating or cooling arrangements, e.g. clamps
- H05K 7/20509: {Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

A heat sink includes a first flange, a second flange, and an accordion-shaped medial portion continuous between the first flange and the second flange. The first flange and the second flange are configured to be attached to a circuit board. The accordion-shaped medial portion includes troughs on a proximal side of the accordion-shaped medial portion and crests on a distal side of the accordion-shaped medial portion such that the heat sink is configured to disperse heat away from the circuit board.

## Claims

### Claim 1

A heat sink comprising:
a first flange;
a second flange; and
an accordion-shaped medial portion continuous between the first flange and the second flange,
wherein:
the first flange and the second flange are configured to be attached to a circuit board; and
the accordion-shaped medial portion includes troughs on a proximal side of the accordion-shaped medial portion and crests on a distal side of the accordion-shaped medial portion such that the heat sink is configured to disperse heat away from the circuit board.

### Claim 2 (depends on 1)

The heat sink of claim 1, wherein the accordion-shaped medial portion includes planar sections between the troughs and the crests.

### Claim 3 (depends on 2)

The heat sink of claim 2, wherein two of the planar sections have a height which is different than a height of each of a remainder of the planar sections.

### Claim 4 (depends on 1)

The heat sink of claim 1, wherein one of the first flange and the second flange is planar.

### Claim 5 (depends on 1)

The heat sink of claim 1, further comprising a spring pin configured to attach one of the first flange and the second flange to the circuit board.

### Claim 6 (depends on 1)

The heat sink of claim 1, further comprising a thermal pad underneath one of the troughs.

### Claim 7 (depends on 1)

The heat sink of claim 1, wherein a length of the first flange is different from a length of the second flange.

### Claim 8 (depends on 1)

The heat sink of claim 1, wherein the troughs and the crests are arcuate.

### Claim 9 (depends on 1)

The heat sink of claim 1, wherein the heat sink is formed of sheet metal.

### Claim 10 (depends on 1)

The heat sink of claim 1, wherein the heat sink is of single piece construction.

### Claim 11

An apparatus comprising:
a circuit board; and
a heat sink;
wherein:
the heat sink comprises a first flange, a second flange, and an accordion-shaped medial portion continuous between the first flange and the second flange;
the first flange and the second flange are attached to the circuit board; and
the accordion-shaped medial portion includes troughs on a proximal side of the accordion-shaped medial portion and crests on a distal side of the accordion-shaped medial portion such that the heat sink is configured to disperse heat away from the circuit board.

### Claim 12 (depends on 11)

The apparatus of claim 11, wherein the circuit board is exposed underneath the crests.

### Claim 13 (depends on 11)

The apparatus of claim 11, wherein:
the circuit board includes front end modules; and
the front end modules are positioned underneath the troughs.

### Claim 14 (depends on 11)

The apparatus of claim 11, wherein the accordion-shaped medial portion includes planar sections between the troughs and the crests.

### Claim 15 (depends on 14)

The apparatus of claim 14, wherein two of the planar sections have a height which is different than a height of each of a remainder of the planar sections.

### Claim 16 (depends on 11)

The apparatus of claim 11, wherein one of the first flange and the second flange is attached to the circuit board by a spring pin.

### Claim 17 (depends on 11)

The apparatus of claim 11, further comprising a thermal pad between one of the troughs and the circuit board.

### Claim 18 (depends on 11)

The apparatus of claim 11, wherein the troughs and the crests are arcuate.

### Claim 19 (depends on 11)

The apparatus of claim 11, wherein the heat sink is formed of sheet metal.

### Claim 20 (depends on 11)

The apparatus of claim 11, wherein the heat sink is of single piece construction.