# US 2021/0280490 A1 · Heat Removal Mechanism for Stack-based Electronic Device With Process Control Component and Processing Components > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2021/0280490 A1 - Document ID: US20210280490A1 - Status: Published application - Kind: A1 - Application number: 17/249,493 - Filed: 2021-03-03 - Published: 2021-09-09 - Earliest claimed: 2020-03-05 - Assignees: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft - Applicants: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft - Inventors: Marco Gavagnin; Gerald Weis; Markus Leitgeb; Gernot Grober; Young Hy Jung - Web page: https://patentgrep.com/patent/US20210280490A1 ## CPC - H05K 1/0204: {using means for thermal conduction connection in the thickness direction of the substrate (H05K1/0207 takes precedence)} - H10W 40/22: characterised by their shape, e.g. having conical or cylindrical projections - H10W 20/4403: {based on metals, e.g. alloys, metal silicides (H10W20/4484 takes precedence)} - H10W 20/48: Insulating materials thereof - H10W 40/258: {Metallic materials (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence)} - H05K 1/0209: {External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings} - H05K 1/183: associated with components mounted in and supported by recessed areas of the PCBs - H05K 1/185: associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards - H05K 3/0061: {onto a metallic substrate, e.g. a heat sink (heat sinks for electric apparatus H05K7/20)} - H05K 3/4697: {having cavities, e.g. for mounting components (H05K3/4691 takes precedence)} - H05K 2201/09036: Recesses or grooves in insulating substrate - H05K 2201/09054: Raised area or protrusion of metal substrate - H05K 2201/10674: Flip chip - H10W 20/023: {the interconnections being through-semiconductor vias} - H10W 70/63: Vias, e.g. via plugs - H10W 70/635: {Through-vias} - H10W 70/68: Shapes or dispositions thereof - H10W 70/682: {comprising holes having chips therein} - H10W 72/241: {Dispositions, e.g. layouts} - H10W 72/59: Bond pads specially adapted therefor - H10W 72/874: {On different surfaces} - H10W 72/877: {Bump connectors and die-attach connectors} - H10W 72/931: {Shapes of bond pads} - H10W 72/934: {Cross-sectional shape, i.e. in side view} - H10W 72/9413: {on encapsulations} - H10W 90/00: Package configurations - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL} - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract An electronic device includes a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, a plurality of processing components on and/or in the stack, a process control component coupled with at least part of the processing components for transmitting signals and configured for controlling processes executed by the processing components and/or by the process control component, and a heat removal structure on or above which at least one of the process control component and the processing components is arranged. ## Claims ### Claim 1 An electronic device, comprising: a stack comprising at least one electrically conductive layer structure and/or at least one electrically insulating layer structure; a plurality of processing components on and/or in the stack; a process control component coupled with at least part of the processing components for transmitting signals and configured for controlling processes executed by the processing components and/or by the process control component; and a heat removal structure on or above which at least one of the process control component and the processing components is arranged for removing heat away from the stack. ### Claim 2 (depends on 1) The electronic device according to claim 1, wherein at least the stack, the processing components and the process control component form part of a component carrier. ### Claim 3 (depends on 1) The electronic device according to claim 1, configured as a component carrier. ### Claim 4 (depends on 1) The electronic device according to claim 1, further comprising at least one of the following features: wherein the at least one electrically conductive layer structure comprises at least one of the group consisting of copper, aluminum, nickel, silver, gold, palladium, and tungsten, any of the mentioned materials being optionally coated with supra-conductive material such as graphene; wherein the at least one electrically insulating layer structure comprises at least one of the group consisting of resin, in particular reinforced or non-reinforced resin, for instance epoxy resin or bismaleimide-triazine resin, FR-4, FR-5, cyanate ester, polyphenylene derivate, glass, prepreg material, polyimide, polyamide, liquid crystal polymer, epoxy-based build-up film, polytetrafluoroethylene, a ceramic, and a metal oxide; wherein the component carrier is shaped as a plate; wherein the component carrier is configured as one of the group consisting of a printed circuit board, a substrate, and an interposer; wherein the component carrier is configured as a laminate-type component carrier. ### Claim 5 (depends on 1) The electronic device according to claim 1, wherein the process control component is configured for controlling, in particular synchronizing, communication between the processing components. ### Claim 6 (depends on 1) The electronic device according to claim 1, further comprising one of the following features: the heat removal structure is assigned to the process control component, whereas no heat removal structure is assigned to the processing components; a respective heat removal structure is assigned to each of the processing components, whereas no heat removal structure is assigned to the process control component; a respective heat removal structure is assigned to each of the processing components and to the process control component. ### Claim 7 (depends on 1) The electronic device according to claim 1, further comprising at least one of the following features: wherein the process control component and the processing components are arranged at respective different vertical levels; wherein at least one of the process control component and the processing components is embedded in an interior of the stack or is arranged in a cavity formed in the stack, wherein in particular the heat removal structure is arranged at an exposed surface of the at least one of the process control component and/or the processing components arranged in the cavity; wherein at least one of the process control component and the processing components is surface-mounted on the stack, wherein in particular no heat removal structure is arranged at the at least one of the process control component and the processing components being surface-mounted; wherein the heat removal structure is configured for removing heat towards a mounting surface of the stack and into a mounting base, wherein the stack is mounted at the mounting surface on the mounting base; wherein the heat removal structure is configured for heat spreading; wherein the heat removal structure is thermally decoupled from the at least one other of the process control component and the processing components being not mounted on or above the heat removal structure. ### Claim 8 (depends on 1) The electronic device according to claim 1, wherein the heat removal structure comprises a thermally conductive sheet, in particular a metallic sheet. ### Claim 9 (depends on 8) The electronic device according to claim 8, further comprising one of the following features: wherein the heat removal structure comprises an array of thermally conductive protrusions extending vertically from the thermally conductive sheet; wherein the heat removal structure has a flat surface. ### Claim 10 (depends on 8) The electronic device according to claim 8, further comprising: a thermally conductive thermal interface material, in particular a thermally conductive paste and/or thermally conductive filler particles, on the thermally conductive sheet, and in particular at least partially covering the array of protrusions. ### Claim 11 (depends on 1) The electronic device according to claim 1, further comprising at least one of the following features: wherein the heat removal structure has at least the same lateral extension as the at least one of the process control component and the processing components being mounted on or above the heat removal structure; multiple heat removal structures, wherein a respective one of the process control component and the processing components is mounted on or above an assigned one of the heat removal structures; wherein a lateral extension of the process control component is larger than a lateral extension of each of the processing components; wherein the at least one electrically conductive layer structure is configured so that electric signal paths within the stack between the process control component and the processing components are substantially vertical. ### Claim 12 (depends on 1) The electronic device according to claim 1, further comprising: a mounting base, in particular a printed circuit board, on which the stack with the process control component and the processing components is mounted. ### Claim 13 (depends on 12) The electronic device according to claim 12, further comprising at least one of the following features: wherein the heat removal structure is arranged at an interface between the mounting base and the stack with the process control component and the processing components; wherein the heat removal structure is fixed on the mounting base and is attached to, or is to be attached to, one of the process control component and the processing components at a bottom of the stack; wherein a thermal interface material arranged between the heat removal structure and said at least one of the process control component and the processing components, configured to expand when heated to thereby trigger a thermal coupling between the heat removal structure and a surface of said at least one of the process control component and the processing components, and being configured to shrink at lower temperatures to a smaller size in which the heat removal structure is not thermally coupled with the surface of said at least one of the process control component and the processing components by the thermal interface material; wherein the process control component is configured for controlling processes executed by the mounting base, in particular executed by at least one electronic component of the mounting base. ### Claim 14 (depends on 1) A method of manufacturing an electronic device according to claim 1, wherein the method comprises: mounting a plurality of processing components on and/or in a stack comprising at least one electrically conductive layer structure and/or at least one electrically insulating layer structure; mounting a process control component, configured for controlling processes executed by at least one of the process control component and the processing components, on and/or in the stack in such a way that the process control component is coupled with at least part of the processing components for transmitting signals; and arranging at least one of the process control component and the processing components on or above a heat removal structure for removing heat out of the stack. ### Claim 15 (depends on 14) The method according to claim 14, wherein the method comprises: forming the heat removal structure on a mounting surface of a mounting base; and thereafter mounting the stack with the process control component and the processing components on the mounting base to thereby thermally couple the heat removal structure with said at least one of the process control component and the processing components.