# US 2021/0280485 A1 · Device and forming method of device

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- Number: US 2021/0280485 A1
- Document ID: US20210280485A1
- Status: Published application
- Kind: A1
- Application number: 17/152,877
- Filed: 2021-01-20
- Published: 2021-09-09
- Earliest claimed: 2020-03-08
- Assignees: Japan Aviation Electronics Industry, Limited
- Applicants: Japan Aviation Electronics Industry, Limited
- Inventors: Shinji UEDA
- Web page: https://patentgrep.com/patent/US20210280485A1

## CPC

- B32B 3/04: characterised by {at least one} layer folded at the edge, e.g. over another layer {; characterised by at least one layer enveloping or enclosing a material}
- H10W 74/127: {characterised by arrangements for sealing or adhesion}
- B32B 3/08: characterised by added members at particular parts {(layer formed of separate pieces of material which are juxtaposed side-by-side B32B3/14, B32B3/18)}
- B32B 7/05: the layers not being connected over the whole surface, e.g. discontinuous connection or patterned connection (using interposed adhesives or bonding materials applied in spaced arrangements B32B7/14)
- B32B 15/20: comprising aluminium or copper {(B32B15/016 and B32B15/017 take precedence)}
- B32B 27/08: of synthetic resin
- B32B 27/32: comprising polyolefins {(comprising vinyl (co)polymers or acrylic (co)polymers B32B27/30)}
- B32B 27/34: comprising polyamides
- B32B 27/36: comprising polyesters
- H10W 70/611: {for connecting multiple chips together}
- H10W 70/65: Shapes or dispositions of interconnections
- H10W 74/01: Manufacture or treatment
- H10W 90/00: Package configurations
- H10W 90/401: {characterised by multiple insulating or insulated package substrates, interposers or RDLs}
- A61B 5/0022: {Monitoring a patient using a global network, e.g. telephone networks, internet}
- A61B 5/024: Measuring pulse rate or heart rate
- B32B 2250/44: Number of layers variable across the laminate
- B32B 2307/202: Conductive
- B32B 2307/206: Insulating
- B32B 2307/7244: Oxygen barrier
- B32B 2307/7246: Water vapor barrier
- B32B 2457/00: Electrical equipment
- H10H 20/036: {of packages}
- H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls
- B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- A61B: DIAGNOSIS; SURGERY; IDENTIFICATION (usefulness limited to only animals A61D)
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS

## Abstract

A device comprises: a first film having a first inner portion, a first seal portion and a first contact portion; a second film having a second inner portion, a second seal portion and a second contact portion; a first circuit member having a first contact point; and a second circuit member having a second contact point. The first seal portion and the second seal portion are bonded together. The first contact portion and the second contact portion are in contact with each other in a contact region which surrounds the first inner portion and the second inner portion throughout their entire circumference. The first circuit member and the second circuit member are shut in a closed space which is enclosed by the first inner portion and the second inner portion. The first contact point and the second contact point are in contact with each other.

## Claims

### Claim 1

A device comprising a first film, a second film, a first circuit member and a second circuit member, wherein:
the first film has a first inner portion and a first outer portion;
the first inner portion is located inward of the first outer portion;
the second film has a second inner portion and a second outer portion;
the second inner portion is located inward of the second outer portion;
the first outer portion has a first seal portion and a first contact portion;
the second outer portion has a second seal portion and a second contact portion;
the first seal portion and the second seal portion are bonded together to form a seal trace;
the first contact portion and the second contact portion are in contact with each other in a contact region;
the contact region surrounds the first inner portion and the second inner portion throughout their entire circumference;
the device is formed with a closed space which is enclosed by the first inner portion and the second inner portion;
the first circuit member and the second circuit member are shut in the closed space;
the first circuit member comprises a first contact point;
the second circuit member comprises a second contact point; and
the first contact point and the second contact point are in contact with each other.

### Claim 2 (depends on 1)

The device as recited in claim 1, wherein the first seal portion and the second seal portion are bonded together by heat-sealing.

### Claim 3 (depends on 2)

The device as recited in claim 2, wherein each of the first film and the second film includes two layers consisting of a meltable layer which is meltable by the heat-sealing and an unmeltable layer which is not meltable by the heat-sealing.

### Claim 4 (depends on 1)

The device as recited in claim 1, wherein:
the first file and the second film are two sheet pieces of a single film member which overlap with each other;
the film member has a predetermined portion and a cutting edge;
the first file and the second film are connected to each other at the predetermined portion; and
the seal trace is formed at least between the contact portion and the cutting edge.

### Claim 5 (depends on 4)

The device as recited in claim 4, wherein:
the film member is a single planar sheet; and
the first file and the second film are the two sheet pieces which are folded at the predetermined portion to overlap with each other.

### Claim 6 (depends on 4)

The device as recited in claim 4, wherein:
the film member is a single folder-like sheet; and
the first file and the second film are the two sheet pieces which are connected to each other at the predetermined portion.

### Claim 7 (depends on 1)

The device as recited in claim 1, wherein:
the first circuit member has a first base portion and a first conductive pattern;
the first base portion is formed of an insulation film;
the first conductive pattern is formed on the first base portion and has the first contact point;
the second circuit member has a second base portion and a second conductive pattern;
the second base portion is formed of an insulation film; and
the second conductive pattern is formed on the second base portion and has the second contact point.

### Claim 8 (depends on 1)

The device as recited in claim 1 wherein each of the first film and the second film has a high barrier property.

### Claim 9 (depends on 8)

The device as recited in claim 8 wherein each of the first film and the second film has a high barrier property against oxygen.

### Claim 10 (depends on 8)

The device as recited in claim 8 wherein each of the first film and the second film has a high barrier property against water vapor.

### Claim 11 (depends on 1)

The device as recited in claim 1 wherein:
the device comprises one or more elastic members;
the elastic members are shut in the closed space;
the elastic members include at least one of a first elastic member and a second elastic member;
the first elastic member is, at least in part, located between the first film and the first contact point; and
the second elastic member is, at least in part, located between the second film and the second contact point.

### Claim 12 (depends on 11)

The device as recited in claim 11 wherein:
each of the elastic members has a body and two main surfaces;
the two main surfaces of each of the elastic members are located opposite to each other in a predetermined direction across the body; and
for each of the elastic members, when the body is compressed so that the two main surfaces are close to each other in the predetermined direction, a part of air contained in the body is discharged, and when compressing of the body is stopped, air flows into the body.

### Claim 13 (depends on 12)

The device as recited in claim 12 wherein each of the elastic members is an open-cell structure.

### Claim 14

A forming method of a device comprising a first film, a second film, a first circuit member and a second circuit member, the forming method comprising:
preparing the first film, the second film, the first circuit member and the second circuit member, the first circuit member comprising a first contact point, the second circuit member comprising a second contact point;
arranging the first film, the first circuit member, the second circuit member and the second film, which are stacked in this order, in a chamber while the first contact point and the second contact point face each other; and
sealing the first film and the second film under a state where the chamber is vacuumed, so that the first circuit member and the second circuit member are shut in a closed space enclosed by the first film and the second film, and the first contact point and the second contact point are brought into contact with each other.

### Claim 15 (depends on 14)

The forming method as recited in claim 14 wherein in the sealing, the first film and the second film are heat-sealed.
