# US 2021/0280482 A1 · Deformable Inductors > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2021/0280482 A1 - Document ID: US20210280482A1 - Status: Published application - Kind: A1 - Application number: 17/192,725 - Filed: 2021-03-04 - Published: 2021-09-09 - Earliest claimed: 2020-03-04 - Assignees: Liquid Wire Inc. - Applicants: Liquid Wire Inc. - Inventors: Mark William Ronay; Trevor Antonio Rivera; Jorge E. Carbo, JR. - Web page: https://patentgrep.com/patent/US20210280482A1 ## CPC - H01F 17/0006: {Printed inductances (printed coils for dynamo-electric machines H02K3/26; printed circuits H05K)} - H10W 44/501: {Inductive arrangements (H10W44/20 takes precedence)} - H05K 1/0283: {Stretchable printed circuits} - H05K 1/09: Use of materials for the {conductive, e.g. } metallic pattern - H05K 1/165: {incorporating printed inductors} - H05K 3/40: Forming printed elements for providing electric connections to or between printed circuits - H05K 3/4664: {Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders (H05K3/4647 takes precedence)} - H10D 1/20: Inductors - H10W 70/479: {on or in insulating or insulated package substrates, interposers, or redistribution layers} - H10W 70/65: Shapes or dispositions of interconnections - H01B 1/16: the conductive material comprising metals or alloys - H01F 2017/0046: {with a conductive path having a bridge} - H10W 74/114: {by a substrate and the encapsulations} - H01F: MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES - H01B: CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F1/00; waveguides H01P {; printed circuits H05K}) ## Abstract A circuit assembly may include a first layer arranged as a substrate, a second layer having a spiral pattern attached to the substrate, wherein the spiral pattern contains a deformable conductor. A circuit assembly may include a first portion of a deformable inductor fabricated on a first layer of the circuit assembly; and a second portion of the deformable inductor fabricated on a second layer of the circuit assembly and electrically connected to the first portion of the deformable inductor. A method may include sensing an interaction with a deformable inductor, wherein the deformable inductor may include an inductive pattern of deformable conductor, and a deformable substrate arranged to support the inductive pattern of deformable conductor. An article of manufacture may include an inductive pattern of deformable conductor, and a deformable substrate arranged to support the inductive pattern of deformable conductor. ## Claims ### Claim 1 A circuit assembly comprising: a first layer arranged as a substrate; a second layer having a spiral pattern attached to the substrate, wherein the spiral pattern contains a deformable conductor. ### Claim 2 (depends on 1) The circuit assembly of claim 1 further comprising a third layer attached to the second layer to encapsulate the deformable conductor in the second layer. ### Claim 3 (depends on 2) The circuit assembly of claim 2 wherein the third layer includes one or more vias containing a deformable conductor. ### Claim 4 (depends on 3) The circuit assembly of claim 3 further comprising a fourth layer attached to the third layer to encapsulate the deformable conductor in the third layer. ### Claim 5 (depends on 4) The circuit assembly of claim 4 wherein the fourth layer includes one or more passages arranged as traces and containing a deformable conductor. ### Claim 6 (depends on 5) The circuit assembly of claim 5 further comprising a fifth layer attached to the fourth layer to encapsulate the deformable conductor in the fourth layer. ### Claim 7 (depends on 6) The circuit assembly of claim 6 wherein the fifth layer includes one or more vias containing a deformable conductor. ### Claim 8 A circuit assembly comprising: a first portion of a deformable inductor fabricated on a first layer of the circuit assembly; and a second portion of the deformable inductor fabricated on a second layer of the circuit assembly and electrically connected to the first portion of the deformable inductor. ### Claim 9 (depends on 8) The circuit assembly of claim 8 wherein the second portion of the deformable inductor is formed in a pattern comprising at least a partial turn. ### Claim 10 (depends on 9) The circuit assembly of claim 9 wherein the pattern comprises a substantially complete turn. ### Claim 11 (depends on 8) The circuit assembly of claim 8 further comprising a deformable substrate disposed between the first layer and the second layer. ### Claim 12 (depends on 11) The circuit assembly of claim 11 wherein the first portion of the deformable inductor is electrically connected to the second portion of the deformable inductor through a via in the deformable substrate. ### Claim 13 A method comprising: sensing an interaction with a deformable inductor; wherein the deformable inductor comprises: an inductive pattern of deformable conductor; and a deformable substrate arranged to support the inductive pattern of deformable conductor. ### Claim 14 (depends on 13) The method of claim 13 wherein sensing the interaction comprises sensing a selfinductance of the deformable inductor. ### Claim 15 (depends on 13) The method of claim 13 wherein sensing the interaction comprises sensing a mutualinductance of the deformable inductor. ### Claim 16 (depends on 15) The method of claim 15 wherein the mutual-inductance comprises a mutual inductance with a structure. ### Claim at position 17 17-20. (canceled)