# US 2021/0280475 A1 · Semiconductor manufacturing apparatus and method of manufacturing semiconductor device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2021/0280475 A1 - Document ID: US20210280475A1 - Status: Published application - Kind: A1 - Application number: 17/017,404 - Filed: 2020-09-10 - Published: 2021-09-09 - Earliest claimed: 2020-03-06 - Assignees: Kioxia Corporation - Applicants: Kioxia Corporation - Inventors: Jun TAKAGI - Web page: https://patentgrep.com/patent/US20210280475A1 ## CPC - H10P 74/238: {comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement} - B24B 37/013: Devices or means for detecting lapping completion - H10P 52/402: {of semiconductor materials} - H10P 74/23: {characterised by multiple measurements, corrections, marking or sorting processes} - H10P 74/203: {Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects} - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - B24B: MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING (grinding of gear teeth B23F, of screw-threads B23G1/36; by electro-erosion B23H; abrasive or related blasting B24C; tools for grinding, buffing or sharpening B24D; polishing compositions C09G1/00; abrasives C09K3/14; electrolytic etching or polishing C25F3/00; grinding arrangements for use on assembled railway tracks E01B31/17); DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ## Abstract In one embodiment, a semiconductor manufacturing apparatus includes a polisher configured to polish a film provided on a substrate. The apparatus further includes a thickness measurement module configured to measure a thickness of the film while the substrate is being conveyed before the polishing. The apparatus further includes a controller configured to control the polishing of the film by the polisher based on the thickness measured by the thickness measurement module. ## Claims ### Claim 1 A semiconductor manufacturing apparatus comprising: a polisher configured to polish a film provided on a substrate; a thickness measurement module configured to measure a thickness of the film while the substrate is being conveyed before the polishing; and a controller configured to control the polishing of the film by the polisher based on the thickness measured by the thickness measurement module. ### Claim 2 (depends on 1) The apparatus of claim 1, wherein the thickness measurement module measures the thickness at a plurality of portions of the film. ### Claim 3 (depends on 1) The apparatus of claim 1, wherein the controller sets a polishing condition in which the polisher polishes the film, based on the thickness measured by the thickness measurement module. ### Claim 4 (depends on 1) The apparatus of claim 1, further comprising a conveyance module configured to hold and convey the substrate, wherein the thickness measurement module is provided in the conveyance module. ### Claim 5 (depends on 4) The apparatus of claim 4, wherein the conveyance module includes a first member positioned under the substrate during the conveyance of the substrate, and the thickness measurement module is provided in the first member. ### Claim 6 (depends on 4) The apparatus of claim 4, wherein the conveyance module includes a second member positioned above the substrate during the conveyance of the substrate, and the thickness measurement module is provided in the second member. ### Claim 7 (depends on 1) The apparatus of claim 1, wherein the thickness measurement module measures the thickness while the substrate is moving. ### Claim 8 (depends on 1) The apparatus of claim 1, wherein the thickness measurement module measures the thickness when the substrate passes through a predetermined point in the semiconductor manufacturing apparatus. ### Claim 9 (depends on 1) The apparatus of claim 1, further comprising a transporter configured to transport the substrate in a polishing chamber provided with the polisher, wherein the thickness measurement module is provided in the transporter. ### Claim 10 (depends on 1) The apparatus of claim 1, further comprising a reversing module configured to reverse orientations of a first face and a second face of the substrate, wherein the thickness measurement module is provided in the reversing module. ### Claim 11 (depends on 2) The apparatus of claim 2, wherein the polisher includes an airbag that presses the substrate against a polishing pad, and the thickness measurement module measures the thickness at the plurality of portions, a number of the portions being equal to or greater than a number of airbag zones of the airbag. ### Claim 12 A method of manufacturing a semiconductor device, comprising: measuring a thickness of a film provided on a substrate by a thickness measurement module while the substrate is being conveyed before polishing by a polisher; polishing the film by the polisher; and controlling, by a controller, the polishing of the film by the polisher based on the thickness measured by the thickness measurement module. ### Claim 13 (depends on 12) The method of claim 12, wherein the thickness measurement module measures the thickness at a plurality of portions of the film. ### Claim 14 (depends on 12) The method of claim 12, wherein the controller sets a polishing condition in which the polisher polishes the film, based on the thickness measured by the thickness measurement module. ### Claim 15 (depends on 12) The method of claim 12, further comprising holding and conveying the substrate by a conveyance module, wherein the thickness measurement module is provided in the conveyance module. ### Claim 16 (depends on 13) The method of claim 13, wherein the polisher includes an airbag that presses the substrate against a polishing pad, and the thickness measurement module measures the thickness at the plurality of portions, a number of the portions being equal to or greater than a number of airbag zones of the airbag. ### Claim 17 A semiconductor manufacturing apparatus comprising: a processing module configured to process a film provided on a substrate; a thickness measurement module configured to measure a thickness of the film while the substrate is being conveyed before the processing; and a controller configured to control the processing of the film by the processing module based on the thickness measured by the thickness measurement module. ### Claim 18 (depends on 17) The apparatus of claim 17, wherein the processing of the film is polishing or etching of the film. ### Claim 19 A method of manufacturing a semiconductor device, comprising: measuring a thickness of a film provided on a substrate by a thickness measurement module while the substrate is being conveyed before processing by a processing module; processing the film by the processing module; and controlling, by a controller, the processing of the film by the processing module based on the thickness measured by the thickness measurement module. ### Claim 20 (depends on 19) The method of claim 19, wherein the processing of the film is polishing or etching of the film.