# US 2021/0280440 A1 · Mounting method and mounting device

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- Number: US 2021/0280440 A1
- Document ID: US20210280440A1
- Status: Published application
- Kind: A1
- Application number: 16/326,512
- Filed: 2017-08-23
- Published: 2021-09-09
- Earliest claimed: 2016-08-24
- Assignees: Toray Engineering Co., Ltd.
- Applicants: Toray Engineering Co., Ltd.
- Inventors: Yoshiyuki ARAI
- Web page: https://patentgrep.com/patent/US20210280440A1

## CPC

- H10P 72/0446: {Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates}
- H10H 20/018: {Bonding of wafers}
- H10P 72/0432: {mainly by conduction}
- H10P 72/0436: {mainly by radiation}
- H10P 72/0442: {Apparatus for placing on an insulating substrate, e.g. tape}
- H10P 72/7402: {Wafer tapes, e.g. grinding or dicing support tapes}
- H10W 72/071: {Connecting or disconnecting}
- H10W 99/00: Subject matter not provided for in other groups of this subclass
- H10H 20/01: Manufacture or treatment
- H10H 20/825: containing nitrogen, e.g. GaN
- H10P 72/7414: {the auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support}
- H10P 72/7416: {used during dicing or grinding}
- H10P 72/7422: {used to protect an active side of a device or wafer}
- H10P 72/7434: {used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate}
- H10P 72/744: {Details of chemical or physical process used for separating the auxiliary support from a device or a wafer}
- H10P 72/78: using vacuum or suction, e.g. Bernoulli chucks
- H10W 72/0198: {batch processes}
- H10W 72/0711: {Apparatus therefor}
- H10W 72/07141: {Means for applying energy, e.g. ovens or lasers}
- H10W 72/072: {of bump connectors}
- H10W 72/07207: {Temporary substrates, e.g. removable substrates}
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A mounting method is a method for mounting a diced semiconductor chip having a first face that is held on a carrier substrate and a second face that is an opposite face of the first face on a circuit board placed on a mounting table. The mounting method includes affixing the second face of the semiconductor chip to an adhesive sheet, removing the carrier substrate from the semiconductor chip, reducing an adhesive strength of the adhesive sheet, and mounting the semiconductor chip on the circuit board by holding a first face side of the semiconductor chip with a head to separate the semiconductor chip from the adhesive sheet, and joining a second face side of the semiconductor chip to the circuit board.

## Claims

### Claim 1

A mounting method for mounting a diced semiconductor chip having a first face that is held on a carrier substrate is and a second face that is an opposite face of the first face on a circuit board that placed on a mounting table, the mounting method comprising:
affixing the second face of the semiconductor chip to an adhesive sheet;
removing the carrier substrate from the semiconductor chip;
reducing an adhesive strength of the adhesive sheet; and
mounting the semiconductor chip on the circuit board by holding a first face side of the semiconductor chip with a head to separate the semiconductor chip from the adhesive sheet, and joining a second face side of the semiconductor chip to the circuit board.

### Claim 2 (depends on 1)

The mounting method according to claim 1, wherein
the removing of the carrier substrate from the semiconductor chip includes separating the carrier substrate by irradiating the carrier substrate with a laser beam.

### Claim 3 (depends on 1)

The mounting method according to claim 1, wherein
the reducing of the adhesive strength of the adhesive sheet includes heating the adhesive sheet and the semiconductor chip to a specific temperature to reduce the adhesive strength of the adhesive sheet.

### Claim 4 (depends on 3)

The mounting method according to claim 3, wherein
the mounting of the semiconductor chip on the circuit board includes performing a heating control of the head and the mounting table such that the semiconductor chip is mounted on the circuit board while maintaining the semiconductor chip at the specific temperature.

### Claim 5 (depends on 1)

The mounting method according to claim 1, wherein
a joint strength between the circuit board and the semiconductor chip in the mounting of the semiconductor chip on the circuit board is greater than a holding strength of the head, and
the holding strength of the head is greater than the adhesive strength of the adhesive sheet after the adhesive strength of the adhesive sheet has been reduced.

### Claim 6

A mounting method for mounting by a mounting head a diced semiconductor chip having a first face that is held on a carrier substrate and a second face that is an opposite face of the first face on a circuit board placed on a mounting table, the mounting method comprising:
affixing the second face of the semiconductor chip to a first adhesive member;
removing the carrier substrate from the semiconductor chip;
affixing a second adhesive member to the first face of the semiconductor chip;
reducing an adhesive strength of the first adhesive member;
separating the semiconductor chip that has been affixed to the second adhesive member from the first adhesive member;
affixing the second face of the semiconductor chip to a third adhesive member;
reducing an adhesive strength of the second adhesive member; and
mounting the semiconductor chip on the circuit board by holding the first face of the semiconductor chip with the mounting head to separate the semiconductor chip from the third adhesive member, and joining the second face of the semiconductor chip to the circuit board,
an adhesive strength of the third adhesive member being less than the adhesive strength of the first adhesive member.

### Claim 7 (depends on 6)

The mounting method according to claim 6, wherein
the reducing of the adhesive strength of the first adhesive member includes reducing the adhesive strength of the first adhesive member by heating the first adhesive member and the semiconductor chip to a first specific temperature at which the adhesive strength of the first adhesive member decreases, and
the reducing of the adhesive strength of the second adhesive member includes reducing the adhesive strength of the second adhesive member by heating the second adhesive member and the semiconductor chip to a second specific temperature that is higher than the first specific temperature and at which the adhesive strength of the second adhesive member decreases.

### Claim 8 (depends on 7)

The mounting method according to claim 7, wherein
the mounting of the semiconductor chip on the circuit board includes performing a heating control of a third adhesive member holder that holds the third adhesive member, the mounting head, and the mounting table such that the semiconductor chip ean-be is mounted on the circuit board while maintaining the semiconductor chip at the second specific temperature.

### Claim 9

A mounting device configured to mount a diced semiconductor chip having a first face that is held on a carrier substrate and a second face that is an opposite face of the first face on a circuit board placed on a mounting table, the mounting device comprising:
an adhesive sheet holder that-holds configured to hold an adhesive sheet to which the second face of the semiconductor chip is configured to be affixed;
a carrier substrate remover configured to remove the carrier substrate from the semiconductor chip that has been affixed to the adhesive sheet;
an adhesive strength reducer configured to reduce an adhesive strength of the adhesive sheet;
a head configured to hold the semiconductor chip from a first face side of the semiconductor chip; and
a controller configured to control the head to hold the semiconductor chip to separate the semiconductor chip from the adhesive sheet, and to join a second face side of the semiconductor chip to the circuit board.

### Claim 10 (depends on 9)

The mounting device according to claim 9, wherein
the carrier substrate remover includes a laser beam emitter that is configured to irradiate the carrier substrate with a laser beam.

### Claim 11 (depends on 9)

The mounting device according to claim 9, wherein the adhesive strength reducer includes a heater that is configured to heat the adhesive sheet and the semiconductor chip to a specific temperature.

### Claim 12 (depends on 11)

The mounting device according to claim 11, wherein
the head and the mounting table are heatable, and
the controller is configured to control a heating temperature of the adhesive strength reducer, the head, and the mounting table such that the semiconductor chip is mounted on the circuit board while maintaining the semiconductor chip at the specific temperature.

### Claim 13 (depends on 9)

The mounting device according to claim 9, wherein
a joint strength between the circuit board and the semiconductor chip when the semiconductor chip is mounted on the circuit board is greater than a holding strength of the head, and
the holding strength of the head is greater than the adhesive strength of the adhesive sheet after the adhesive strength of the adhesive sheet has been reduced.

### Claim 14

A mounting device configured to mount by a mounting head a diced semiconductor chip having a first face that is held on a carrier substrate and a second face that is an opposite face of the first face on a circuit board placed on a mounting table, the mounting device comprising:
a first adhesive member holder having a first adhesive member heating mechanism and configured to hold a first adhesive member;
a carrier substrate remover configured to remove the carrier substrate from the semiconductor chip that has been affixed to the first adhesive member;
a first transfer head that-has having a first transfer head heating mechanism and configured to affix a second adhesive member to the first face of the semiconductor chip;
a second transfer head having a second transfer head heating mechanism and that configured to affix the semiconductor chip to a third adhesive member;
a third adhesive member holder having a third adhesive member heating mechanism and configured to hold the third adhesive member;
a first adhesive strength reducer configured to reduce an adhesive strength of the first adhesive member; and
a second adhesive strength reducer configured to reduce an adhesive strength of the second adhesive member,
an adhesive strength of the third adhesive member being less than the adhesive strength of the first adhesive member.

### Claim 15 (depends on 14)

The mounting device according to claim 14, wherein
the first adhesive strength reducer configured to control the first adhesive member heating mechanism and the first transfer head heating mechanism to be heated to a first specific temperature at which the adhesive strength of the first adhesive member decreases, and
the second adhesive strength reducer configured to control the third adhesive member heating mechanism and the second transfer head heating mechanism to be heated to a second specific temperature that is higher than the first specific temperature and at which the adhesive strength of the second adhesive member decreases.

### Claim 16 (depends on 15)

The mounting device according to claim 15, further comprising
a mounting temperature controller configured to control a heating temperature of a third adhesive member heating mechanism, a mounting head heating mechanism of the mounting head, and a mounting table heating mechanism of the mounting table such that the semiconductor chip is mounted on the circuit board while maintaining the semiconductor chip at the second specific temperature.

### Claim 17 (depends on 2)

The mounting method according to claim 2, wherein
the reducing of the adhesive strength of the adhesive sheet includes heating the adhesive sheet and the semiconductor chip to a specific temperature to reduce the adhesive strength of the adhesive sheet.

### Claim 18 (depends on 17)

The mounting method according to claim 17, wherein
the mounting of the semiconductor chip on the circuit board includes performing a heating control of the head and the mounting table such that the semiconductor chip is mounted on the circuit board while maintaining the semiconductor chip at the specific temperature.

### Claim 19 (depends on 10)

The mounting device according to claim 10, wherein
the adhesive strength reducer includes a heater that is configured to heat the adhesive sheet and the semiconductor chip to a specific temperature.

### Claim 20 (depends on 19)

The mounting device according to claim 19, wherein
the head and the mounting table are heatable, and
the controller is configured to control a heating temperature of the adhesive strength reducer, the head, and the mounting table such that the semiconductor chip is mounted on the circuit board while maintaining the semiconductor chip at the specific temperature.