# US 2021/0280436 A1 · Method of applying conductive adhesive and manufacturing device using the same

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- Number: US 2021/0280436 A1
- Document ID: US20210280436A1
- Status: Published application
- Kind: A1
- Application number: 17/327,270
- Filed: 2021-05-21
- Published: 2021-09-09
- Earliest claimed: 2018-11-07
- Assignees: Epistar Corporation
- Applicants: Epistar Corporation
- Inventors: Min-Hsun HSIEH
- Web page: https://patentgrep.com/patent/US20210280436A1

## CPC

- H10W 70/098: {Applying pastes or inks, e.g. screen printing (H10W70/095 takes precedence)}
- B23K 1/0016: {Soldering of electronic components}
- B23K 3/0623: {for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets}
- H10W 72/011: {Apparatus therefor}
- H10W 72/0112: {Apparatus for manufacturing bump connectors}
- H10W 72/0113: {Apparatus for manufacturing die-attach connectors}
- H10W 72/01204: {using temporary auxiliary members, e.g. using sacrificial coatings or handle substrates}
- H10W 72/01223: {in liquid form, e.g. by dispensing droplets or by screen printing}
- H10W 72/01304: {using temporary auxiliary members, e.g. using sacrificial coatings or handle substrates}
- H10W 72/01323: {in liquid form, e.g. by dispensing droplets or by screen printing}
- H10W 72/01351: {Changing the shapes of die-attach connectors}
- H10W 72/07118: {Means for cleaning, e.g. brushes}
- H10W 72/07131: {Means for applying material, e.g. for deposition or forming coatings}
- H10W 72/07168: {Means for storing or moving the material for the connector}
- H10W 72/07173: {Means for moving chips, wafers or other parts, e.g. conveyor belts}
- H10W 72/07178: {Means for aligning}
- H10W 72/072: {of bump connectors}
- H10W 72/07236: {Soldering or alloying}
- H10W 72/073: {of die-attach connectors}
- H10W 72/07331: {Connecting techniques}
- H10W 72/07338: {hardening the adhesive by curing, e.g. thermosetting}
- H10W 72/07339: {hardening the adhesive by cooling, e.g. thermoplastics}
- H10W 72/074: {of anisotropic conductive adhesives}
- H10W 72/232: {Plan-view shape, i.e. in top view}
- H10W 72/30: Die-attach connectors
- H10W 72/321: {Structures or relative sizes of die-attach connectors}
- H10W 72/324: {Die-attach connectors having multiple side-by-side cores}
- H10W 72/325: {Die-attach connectors having a filler embedded in a matrix}
- H10W 72/332: {Plan-view shape, i.e. in top view}
- H10W 72/348: {Top-view layouts, e.g. mirror arrays}
- H10W 72/352: {comprising metals or metalloids, e.g. solders}
- H10W 72/354: {comprising polymers}
- H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM

## Abstract

An applying method includes the following steps. Firstly, a conductive adhesive including a plurality of conductive particles and an insulating binder is provided. Then, a carrier plate is provided. Then, a patterned adhesive is formed on the carrier plate by the conductive adhesive, wherein the patterned adhesive includes a first transferring portion. Then, a manufacturing device including a needle is provided. Then, the needle of the manufacturing device is moved to contact the first transferring portion. Then, the transferring portion is transferred to a board by the manufacturing device.

## Claims

### Claim 1

A manufacturing system, comprising:
a carrier plate configured to accommodate an adhesive material; and
a needle array device arranged on the carrier plate, and comprising a plate and a plurality of needles associated with the plate;
wherein the plurality of needles is configured to approach the carrier plate for capturing portions of the adhesive material from the carrier plate, and
wherein the adhesive material comprises a plurality of conductive particles and an insulating binder wherein the plurality of conductive particles is dispersed.

### Claim 2 (depends on 1)

The manufacturing system according to claim 1, wherein the adhesive material has a patterned shape which includes a plurality of transferring portions separated from each other.

### Claim 3 (depends on 1)

The manufacturing system according to claim 1, wherein the adhesive material is provided in a linear arrangement.

### Claim 4 (depends on 1)

The manufacturing system according to claim 1, wherein the needle array device comprises a base therein the plurality of needles is fixed, and a scraping portion disposed between the base and the plurality of needles and configured to scrap the adhesive material from the plurality of needles.

### Claim 5 (depends on 4)

The manufacturing system according to claim 4, wherein the scraping portion is movable along with a direction parallel to the plurality of needles.

### Claim 6 (depends on 4)

The manufacturing system according to claim 4, wherein the scraping portion is movable downward for scarping the adhesive material from the plurality of needles.

### Claim 7 (depends on 4)

The manufacturing system according to claim 4, wherein the base has a plurality of through holes corresponding to the plurality of needles.

### Claim 8 (depends on 1)

The manufacturing system according to claim 1, wherein the portions of the adhesive material substantially have identical amounts.

### Claim 9 (depends on 1)

The manufacturing system according to claim 1, further comprising a circuit board which includes a plurality of pads.

### Claim 10 (depends on 9)

The manufacturing system according to claim 9, wherein the portions of the adhesive material are configured to transfer to the circuit board.