# US 2021/0280413 A1 · Electronic apparatus > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2021/0280413 A1 - Document ID: US20210280413A1 - Status: Published application - Kind: A1 - Application number: 17/328,031 - Filed: 2021-05-24 - Published: 2021-09-09 - Earliest claimed: 2016-07-29 - Assignees: Japan Display Inc. - Applicants: Japan Display Inc. - Inventors: Yoshikatsu IMAZEKI; Shoji HINATA - Web page: https://patentgrep.com/patent/US20210280413A1 ## CPC - H10P 14/6506: {Formation of intermediate materials} - C30B 29/22: Complex oxides - G02F 1/1345: Conductors connecting electrodes to cell terminals - H10P 14/6328: {Deposition from the gas or vapour phase} - H10P 14/6938: {the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides} - H10P 32/00: Diffusion of dopants within, into or out of wafers, substrates or parts of devices (during formation of materials H10P14/00) - H10W 15/00: Highly-doped buried regions of integrated devices - H10W 15/01: {Manufacture or treatment} - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - C30B: SINGLE-CRYSTAL GROWTH (by using ultra-high pressure, e.g. for the formation of diamonds, B01J3/06); UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL (zone-refining of metals or alloys C22B); PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE (casting of metals, casting of other substances by the same processes or devices B22D; working of plastics B29; modifying the physical structure of metals or alloys C21D, C22F); SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE (for producing semiconductor devices or parts thereof H10); APPARATUS THEREFOR - G02F: OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract An electronic apparatus is provided and includes a first substrate comprising a first conductive layer; a second substrate which is opposed to the first conductive layer and is separated from the first conductive layer, the second substrate including a second conductive layer, and a first hole penetrating the second substrate; and a connecting material which electrically connects the first conductive layer and the second conductive layer via the first hole, wherein the connecting material consists of a single material; and the second conductive layer is located on the second substrate on a side opposite to a side that is opposed to the first conductive layer. ## Claims ### Claim 1 An electronic apparatus comprising: a first substrate comprising a first conductive layer; a second substrate which is opposed to the first conductive layer and is separated from the first conductive layer, the second substrate comprising: a second conductive layer, and a first hole penetrating the second substrate; and a connecting material which electrically connects the first conductive layer and the second conductive layer via the first hole, wherein the connecting material consists of a single material; and the second conductive layer is located on the second substrate on a side opposite to a side that is opposed to the first conductive layer. ### Claim 2 (depends on 1) The electronic apparatus according to claim 1, wherein: the second conductive layer includes a second upper surface, and a second inner surface facing the first hole; and the connecting material is in contact with the second upper surface and the second inner surface. ### Claim 3 (depends on 1) The electronic apparatus according to claim 1, wherein: the second conductive layer includes, a first layer, a second layer overlapping the first layer and having a lower reflectance than the first layer, and an aperture in which the second layer is removed and the first layer is exposed; and the connecting material is in contact with the second layer, and also contacts the first layer in the aperture. ### Claim 4 (depends on 1) The electronic apparatus according to claim 1, further comprising an organic insulating layer which is located between the first conductive layer and the second substrate, wherein: the first conductive layer includes a first upper surface; the organic insulating layer is in contact with the first upper surface; the organic insulating layer includes a third hole connected to the first hole; and the connecting material is in contact with the first upper surface via the third hole. ### Claim 5 (depends on 4) The electronic apparatus according to claim 4, wherein: the first conductive layer includes a second hole opposed to the first hole, and a first inner surface facing the second hole; and the connecting material is in contact with the first inner surface. ### Claim 6 (depends on 5) The electronic apparatus according to claim 5, wherein the third hole is greater than the second hole in planar view. ### Claim 7 (depends on 4) The electronic apparatus according to claim 4, wherein a portion of the first upper surface that is in contact with the connecting material is formed to be annular. ### Claim 8 (depends on 4) The electronic apparatus according to claim 4, wherein: the organic insulating layer includes a first organic insulating layer which is provided in the first substrate and is in contact with the first upper surface, and a seal which bonds the first substrate and the second substrate together; the third hole includes a first portion penetrating the first organic insulating layer, and a second portion penetrating the seal; the first substrate comprises a third conductive layer which is located between the first organic insulating layer and the seal, and is electrically connected to the first conductive layer; the third conductive layer includes an annular portion which is not covered with the first organic insulating layer and the seal; and the connecting material is in contact with the annular portion. ### Claim 9 (depends on 1) The electronic apparatus according to claim 1, wherein the second substrate includes a first surface opposed to the first conductive layer, and a second surface on a side opposite to the first surface; the first hole penetrates the first surface and the second surface; and the first hole includes a first portion provided within the first surface, and a second portion provided within the second surface, the first portion being smaller than the second portion. ### Claim 10 (depends on 9) The electronic apparatus according to claim 9, wherein a width of the first hole is increased from the first surface toward the second surface in a cross-sectional view. ### Claim 11 (depends on 9) The electronic apparatus according to claim 9, wherein: each of the first portion and the second portion is formed in a circular shape; and the first hole is formed in a shape of a truncated cone. ### Claim 12 (depends on 11) The electronic apparatus according to claim 11, wherein centers of the first portion and the second portion are located on a same straight line that is parallel to a normal of the second substrate. ### Claim 13 (depends on 9) The electronic apparatus according to claim 9, wherein the first hole includes at least one of a straight line and a curved line in a cross-sectional view between the first portion and the second portion.