# US 2021/0280343 A1 · Surface-mounted resistor

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- Number: US 2021/0280343 A1
- Document ID: US20210280343A1
- Status: Published application
- Kind: A1
- Application number: 17/176,274
- Filed: 2021-02-16
- Published: 2021-09-09
- Earliest claimed: 2020-03-03
- Assignees: Koa Corporation
- Applicants: Koa Corporation
- Inventors: Daigo Hayashi; Jun Ito; Yuko Tezuka
- Web page: https://patentgrep.com/patent/US20210280343A1

## CPC

- H01C 17/006: {adapted for manufacturing resistor chips}
- H01C 1/014: the resistor being suspended between and being supported by two supporting sections (H01C1/016 takes precedence)
- H01C 1/144: the terminals or tapping points being welded or soldered
- H01C 1/148: the terminals embracing or surrounding the resistive element (H01C1/142 takes precedence)
- H01C 7/001: {Mass resistors}
- H01G 11/00: Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
- H01C: RESISTORS
- H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10)

## Abstract

A highly reliable surface-mounted resistor, which prevents a problem of disconnection between an electrode and a terminal of a chip resistor when heating during mounting, is disclosed. The surface-mounted resistor includes a chip resistor comprising a plate-shaped substrate, a resistance body formed on an upper surface of the substrate, and an electrode connected the resistance body and drawn from the upper surface of the substrate to a lower surface via an end surface, a plate-shaped lead terminal connected to the electrode of the chip resistor, the plate-shaped lead terminal being fixed to the electrode of the substrate on the lower surface side, and an exterior member covering an entire chip resistor and a part of the lead terminal.

## Claims

### Claim 1

A surface-mounted resistor comprising:
a chip resistor comprising a plate-shaped substrate, a resistance body formed on an upper surface of the substrate, and an electrode connected the resistance body and drawn from the upper surface of the substrate to a lower surface via an end surface;
a plate-shaped lead terminal connected to the electrode, the lead terminal being fixed to the electrode of the substrate on the lower surface side; and
an exterior member covering an entire chip resistor and a part of the lead terminal.

### Claim 2 (depends on 1)

The surface-mounted resistor according to claim 1, wherein the lead terminal is also fixed to the electrode formed on the end surface of the substrate.

### Claim 3 (depends on 1)

The surface-mounted resistor according to claim 1, wherein the electrode and the lead terminal are soldered together, and a solder does not protrude from a facing surface between the electrode and the lead terminal.

### Claim 4

A method for manufacturing of a surface-mounted resistor comprising:
preparing a lead frame and processing the lead frame into a comb shape;
bending a portion processed the comb shape to form a portion for placing a chip resistor;
applying a solder material to the portion for placing the chip resistor, and placing an electrode of the chip resistor on the portion to solder the chip resistor to the portion processed the comb shape of the lead frame by heating;
covering an entire chip resistor and a pan of the lead frame with an exterior member; and
cutting and bending the portion processed the comb shape of the lead frame.