# US 2021/0279543 A1 · Rfid tag substrate, rfid tag, and rfid system > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2021/0279543 A1 - Document ID: US20210279543A1 - Status: Published application - Kind: A1 - Application number: 17/269,051 - Filed: 2019-08-21 - Published: 2021-09-09 - Earliest claimed: 2018-08-22 - Assignees: KYOCERA Corporation - Applicants: KYOCERA Corporation - Inventors: Shuichi YAMAMOTO; Takuya HAYASHI - Web page: https://patentgrep.com/patent/US20210279543A1 ## CPC - G06K 19/07745: {Mounting details of integrated circuit chips} - H01Q 9/0421: {with a shorting wall or a shorting pin at one end of the element (H01Q9/0414 takes precedence)} - G06K 19/07747: {at least one of the integrated circuit chips being mounted as a module} - G06K 19/07758: {arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag} - G06K 19/07773: {Antenna details (antennas for wireless devices, e.g. RFID tags, in general H01Q1/22)} - G06K 19/07786: {the antenna being of the HF type, such as a dipole} - G06K 19/0779: {the antenna being foldable or folded} - H01Q 1/2225: {used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal} - H01Q 9/0414: {in a stacked or folded configuration} - G06K: GRAPHICAL DATA READING (image or video recognition or understanding G06V); PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS - H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72) ## Abstract An RFID tag board includes an insulating substrate provided with a first surface conductor, a second surface conductor, a short-circuit part through conductor, a capacitance conductor, a capacitance part through conductor, a first electrode and a second electrode. The short-circuit part through conductor electrically connects the first surface conductor and the second surface conductor. The capacitance conductor faces at least part of one of the first and second surface conductors to form a capacitance element. The capacitance part through conductor electrically connects the capacitance conductor and the other one of the first and second surface conductors. First and second conductors of the capacitance element are electrically connected to the first and second electrodes, respectively, not via the short-circuit part through conductor. A distance from the first electrode to the short-circuit part through conductor is shorter than a distance from the second electrode to the short-circuit part through conductor. ## Claims ### Claim 1 An RFID tag board having a plate surface on which a semiconductor integrated circuit is to be mounted, the RFID tag board being used with the plate surface and the semiconductor integrated circuit thereon sealed with a sealing member, comprising: an insulating substrate one surface of which forms the plate surface; a first surface conductor that is disposed on the one surface of the insulating substrate; a second surface conductor that is disposed on a surface of the insulating substrate opposite to the one surface; a short-circuit part through conductor that passes through the insulating substrate in a thickness direction to electrically connect the first surface conductor and the second surface conductor; a capacitance conductor that is disposed in the insulating substrate and faces at least part of the first surface conductor or at least part of the second surface conductor to form a capacitance element; a capacitance part through conductor that is disposed in the insulating substrate to electrically connect the capacitance conductor and one of the first surface conductor and the second surface conductor not facing the capacitance conductor; a first electrode that is disposed on the one surface of the insulating substrate and to which, among terminals that the semiconductor integrated circuit has, a terminal from which a voltage signal relating to a transmission radio wave is output is electrically connected; and a second electrode that is disposed on the one surface of the insulating substrate and to which, among the terminals that the semiconductor integrated circuit has, a terminal serving as a reference potential is electrically connected, wherein a first conductor of a pair of conductors that forms the capacitance element is electrically connected to the first electrode not via the short-circuit part through conductor, and a second conductor of the pair of conductors is electrically connected to the second electrode not via the short-circuit part through conductor, and wherein a distance from the first electrode to the short-circuit part through conductor is shorter than a distance from the second electrode to the short-circuit part through conductor. ### Claim 2 (depends on 1) The RFID tag board according to claim 1, wherein a distance from the first electrode to the capacitance part through conductor is longer than a distance from the second electrode to the capacitance part through conductor. ### Claim 3 (depends on 1) The RFID tag board according to claim 1, wherein the capacitance conductor faces at least part of the second surface conductor to form the capacitance element, wherein the first conductor is the capacitance conductor, and the second conductor is the second surface conductor, wherein the first electrode is electrically connected to the capacitance conductor via a first interlayer through conductor that is disposed in a layer of the insulating substrate between the first electrode and the capacitance conductor, wherein the second electrode is electrically connected to the second surface conductor via a second interlayer through conductor that passes through the insulating substrate, and wherein the distance from an electrical connection point on the capacitance conductor with the first electrode to the short-circuit part through conductor is shorter than the distance from an electrical connection point on the second surface conductor with the second electrode to the short-circuit part through conductor. ### Claim 4 (depends on 3) The RFID tag board according to claim 3, wherein a distance from an electrical connection point on the capacitance conductor with the first electrode to the capacitance part through conductor is longer than a distance from an electrical connection point on the second surface conductor with the second electrode to the capacitance part through conductor. ### Claim 5 (depends on 1) The RFID tag board according to claim 1, wherein the capacitance conductor faces at least part of the first surface conductor to form the capacitance element. ### Claim 6 (depends on 5) The RFID tag board according to claim 5, wherein the first conductor is the first surface conductor, and the second conductor is the capacitance conductor, wherein the second electrode is electrically connected to the second surface conductor via a second interlayer through conductor that passes through the insulating substrate, and wherein the distance from an electrical connection point on the first surface conductor with the first electrode to the short-circuit part through conductor is shorter than the distance from an electrical connection point on the second surface conductor with the second electrode to the short-circuit part through conductor. ### Claim 7 (depends on 6) The RFID tag board according to claim 6, wherein a distance from an electrical connection point on the first surface conductor with the first electrode to the capacitance part through conductor is longer than a distance from an electrical connection point on the second surface conductor with the second electrode to the capacitance part through conductor. ### Claim 8 (depends on 5) The RFID tag board according to claim 5, wherein the first conductor is the first surface conductor, and the second conductor is the capacitance conductor, wherein the second electrode is electrically connected to the capacitance conductor via a third interlayer through conductor that is disposed in a layer of the insulating substrate between the second electrode and the capacitance conductor, and wherein the distance from an electrical connection point on the first surface conductor with the first electrode to the short-circuit part through conductor is shorter than the distance from an electrical connection point on the capacitance conductor with the second electrode to the short-circuit part through conductor. ### Claim 9 (depends on 8) The RFID tag board according to claim 8, wherein a distance from an electrical connection point on the first surface conductor with the first electrode to the capacitance part through conductor is longer than a distance from an electrical connection point on the capacitance conductor with the second electrode to the capacitance part through conductor. ### Claim 10 (depends on 1) An RFID tag comprising: the RFID tag board according to claims 1; the semiconductor integrated circuit that is mounted on the plate surface of the RFID tag board; and the sealing member with which the plate surface of the RFID tag board and the semiconductor integrated circuit thereon are sealed. ### Claim 11 (depends on 10) An RFID system comprising: the RFID tag according to claim 10; and a reader/writer that transmits and receives a radio wave to and from the RFID tag.