# US 2021/0278885 A1 · Configurable heatsink > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2021/0278885 A1 - Document ID: US20210278885A1 - Status: Published application - Kind: A1 - Application number: 16/813,590 - Filed: 2020-03-09 - Published: 2021-09-09 - Earliest claimed: 2020-03-09 - Assignees: NVIDIA Corporation - Applicants: NVIDIA Corporation - Inventors: Michael L. Sabotta; Susheela N. Narasimhan; Reza Azizian; Herman W. Chu - Web page: https://patentgrep.com/patent/US20210278885A1 ## CPC - G06F 1/20: Cooling means - F28D 15/0241: {the tubes being flexible} - H05K 7/20154: {Heat dissipaters coupled to components} - H05K 7/20163: {the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels} - H05K 7/20209: {Thermal management, e.g. fan control} - H10W 40/772: {Bellows} - G06F 2200/201: Cooling arrangements using cooling fluid - H10W 40/43: by flowing gases, e.g. forced air cooling - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) - F28D: HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT (fluid heaters having heat generating means and heat transferring means F24H; furnaces F27; details of heat-exchange apparatus of general) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract Apparatuses, systems, and techniques to cool computer processors. In at least one embodiment, a system comprises one or more processors and a heatsink connected by a flexible heat conduit to the one or more processors, and a position of the heatsink is adjustable. ## Claims ### Claim 1 A system, comprising: one or more processors; and a heatsink connected by a flexible heat conduit to the one or more processors, wherein a position of the heatsink is adjustable. ### Claim 2 (depends on 1) The system of claim 1, wherein the one or more processors comprise one or more graphics processing units. ### Claim 3 (depends on 1) The system of claim 1, wherein the flexible heat conduit comprises a loop siphon. ### Claim 4 (depends on 1) The system of claim 1, wherein the position heatsink is adjustable to a plurality of positions to improve heat dissipation by the heatsink. ### Claim 5 (depends on 1) The system of claim 1, wherein the position of the heatsink is adjustable to improve at least one of utilization, velocity, or temperature of airflow to a second heatsink. ### Claim 6 (depends on 1) The system of claim 1, wherein the position of the heatsink is adjustable to accommodate siting of the heatsink on a chassis. ### Claim 7 (depends on 1) The system of claim 1, further comprising a mounting device comprising one or more attachment points, the one or more attachment points permitting to be position of the heatsink to be adjusted. ### Claim 8 (depends on 1) The system of claim 1, wherein the position of the heatsink is at least one of angularly, horizontally, or vertically adjustable with respect a plane defined by a surface on which the one or more processors are mounted. ### Claim 9 A system, comprising: a heatsink; and a flexible heat conduit to connect to one or more processors, wherein a position of the heatsink, while connected to the one or more processors, is adjustable. ### Claim 10 (depends on 9) The system of claim 9, wherein the flexible heat conduit comprises a loop siphon. ### Claim 11 (depends on 10) The system of claim 10, wherein the heatsink connects to the one or more processors by a reservoir base. ### Claim 12 (depends on 9) The system of claim 9, wherein the heatsink is adjustable to a plurality of positions. ### Claim 13 (depends on 9) The system of claim 9, wherein the position of the heatsink is adjustable to maximize airflow to a second heatsink. ### Claim 14 (depends on 9) The system of claim 9, wherein the position of the heatsink is adjustable to lower temperature of airflow to a second heatsink. ### Claim 15 (depends on 9) The system of claim 9, wherein the position of the heatsink is adjustable to accommodate siting of the heatsink on a chassis. ### Claim 16 (depends on 9) The system of claim 9, further comprising a mounting device comprising one or more attachment points, the one or more attachment points permitting to be position of the heatsink to be adjusted. ### Claim 17 A method, comprising: providing a heatsink connectable, by a flexible heat conduit, to one or more processors, wherein a position of the heatsink, while connected to the one or more processors, is adjustable. ### Claim 18 (depends on 17) The method of claim 17, wherein the flexible heat conduit comprises a loop siphon. ### Claim 19 (depends on 18) The method of claim 18, further comprising connecting the flexible heat conduit to the one or more processors by a reservoir base. ### Claim 20 (depends on 17) The method of claim 17, further comprising adjusting the position of the heatsink to maximize airflow to the heatsink. ### Claim 21 (depends on 17) The method of claim 17, further comprising adjusting the position of the heatsink to maximize airflow to a second heatsink. ### Claim 22 (depends on 17) The method of claim 17, further comprising adjusting the position of the heatsink to lower temperature of airflow to a second heatsink. ### Claim 23 (depends on 17) The method of claim 17, further comprising adjusting the position of the heatsink to accommodate siting of the heatsink on a chassis. ### Claim 24 A graphics card, comprising: one or more graphics processing units; and a heatsink connected by a flexible heat conduit to the one or more graphics processing units, wherein a position of the heatsink is adjustable. ### Claim 25 (depends on 24) The graphics card of claim 24, further comprising a support to attach the heatsink to the graphics card, the support comprising a plurality of mounting points for securing the heatsink in one of a plurality of positions. ### Claim 26 (depends on 24) The graphics card of claim 24, wherein the position of the heatsink can be at least one of raised or lowered. ### Claim 27 (depends on 24) The graphics card of claim 24, wherein adjustment of the position comprises tilting the heatsink. ### Claim 28 (depends on 24) The graphics card of claim 24, wherein the flexible heat conduit comprises a loop siphon. ### Claim 29 (depends on 24) The graphics card of claim 24, wherein the flexible heat conduit comprises a base to attach the heatsink to the one or more graphics processing units. ### Claim 30 (depends on 24) The graphics card of claim 24, wherein adjustment of the position improves airflow to the heatsink. ### Claim 31 (depends on 24) The graphics card of claim 24, wherein adjustment of the position improves airflow to a second heatsink.