# US 2021/0278614 A1 · Optical module

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- Number: US 2021/0278614 A1
- Document ID: US20210278614A1
- Status: Published application
- Kind: A1
- Application number: 17/132,918
- Filed: 2020-12-23
- Published: 2021-09-09
- Earliest claimed: 2020-03-04
- Assignees: Fujitsu Optical Components Limited
- Applicants: Fujitsu Optical Components Limited
- Inventors: TERUHIRO KUBO; YUKA OJIMA; Tetsuo Ishizaka; Tomoyuki Ito
- Web page: https://patentgrep.com/patent/US20210278614A1

## CPC

- G02B 6/4266: {Thermal aspects, temperature control or temperature monitoring (thermal aspect of electrical circuits H05K7/20, H05K5/0213, temperature control in general G05D23/19)}
- H05K 7/20445: {the coupling element being an additional piece, e.g. thermal standoff}
- G02B 6/4257: {having a supporting carrier or a mounting substrate or a mounting plate (G02B6/3648 takes precedence)}
- G02B 6/428: {containing printed circuit boards [PCB]}
- G02B 6/4284: {of optical modules with disconnectable electrical connectors (latching arms for electrical connectors H01R13/627)}
- H05K 1/0203: {Cooling of mounted components (H05K1/0272 takes precedence)}
- H05K 7/2039: {characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00)}
- G02B 6/4204: {the coupling comprising intermediate optical elements, e.g. lenses, holograms (encapsulated active devices H01S5/02208)}
- G02B 6/4206: {Optical features (G02B6/4207, G02B6/421 take precedence)}
- G02B 6/4269: {with heat sinks or radiation fins}
- G02B 6/4273: {with heat insulation means to thermally decouple or restrain the heat from spreading}
- G02B 6/4274: {Electrical aspects (G02B6/4263 and G02B6/4265 take precedence)}
- G02B 6/4292: {the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements}
- G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

An optical module includes: a board that is accommodated in a housing and in which a through hole is formed; a metal plate that is bonded to an area of the board including the through hole; a component that is mounted on one surface of the metal plate and is arranged inside the through hole; and a thermal-conductive member that is arranged on another surface of the metal plate and transmits heat generated by the component to the housing.

## Claims

### Claim 1

An optical module comprising:
a board that is accommodated in a housing and in which a through hole is formed;
a metal plate that is bonded to an area of the board including the through hole;
a component that is mounted on one surface of the metal plate and is arranged inside the through hole; and
a thermal-conductive member that is arranged on another surface of the metal plate and transmits heat generated by the component to the housing.

### Claim 2 (depends on 1)

The optical module according to claim 1, wherein the component includes:
an optical modulator that modulates light emitted by a light source; and
an optical component that sends, to an optical fiber, an optical signal obtained by modulation by the optical modulator.

### Claim 3 (depends on 2)

The optical module according to claim 2, wherein the optical modulator is arranged inside the through hole such that a height of a surface of the optical modulator is substantially same as a height of a surface of the board, and the surface of the optical modulator is connected to the surface of the board by a wire.

### Claim 4 (depends on 2)

The optical module according to claim 2, wherein the component further includes a driver that supplies a transmission signal to the optical modulator.

### Claim 5 (depends on 4)

The optical module according to claim 4, wherein the driver is arranged inside the through hole such that a height of a surface of the driver is substantially same as a height of a surface of the board, and the surface of the driver is connected to the surface of the board by a wire.

### Claim 6 (depends on 1)

The optical module according to claim 1, further comprising an optical component that converts an input optical signal into an electrical signal, wherein
the board has a recessed portion that is formed in a surface of the board to which the metal plate is bonded, and
the optical component is arranged in the recessed portion.

### Claim 7 (depends on 6)

The optical module according to claim 6, wherein the optical component is arranged in the recessed portion such that a height of a surface of the optical component is substantially same as a height of the surface of the board, and the surface of the optical component is connected to the surface of the board by a wire.

### Claim 8 (depends on 1)

The optical module according to claim 1, further comprising a heat-generating component that is arranged on a surface of the board to which the metal plate is bonded, and generates heat.

### Claim 9 (depends on 8)

The optical module according to claim 8, further comprising an electronic component that is arranged on a surface of the board opposite to the surface to which the metal plate is bonded, and generates a smaller amount of heat than the heat-generating component does.