# US 2021/0278293 A1 · Sensor, input apparatus, and electronic device

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- Number: US 2021/0278293 A1
- Document ID: US20210278293A1
- Status: Published application
- Kind: A1
- Application number: 17/256,534
- Filed: 2019-06-28
- Published: 2021-09-09
- Earliest claimed: 2018-06-28
- Assignees: Sony Corporation
- Applicants: Sony Corporation
- Inventors: Keisuke KINOKUNI; Makoto YAMAGUCHI; Hiroaki YAMANA; Masakazu KOBAYASHI; Ryo SHIRAIWA
- Web page: https://patentgrep.com/patent/US20210278293A1

## CPC

- G01L 1/142: {using capacitors}
- G06F 1/16: Constructional details or arrangements
- G06F 3/0414: {using force sensing means to determine a position}
- G06F 3/044: by capacitive means
- G06F 3/0445: {using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer}
- G06F 3/0447: {Position sensing using the local deformation of sensor cells}
- G06F 3/0448: {Details of the electrode shape, e.g. for enhancing the detection of touches, for generating specific electric field shapes, for enhancing display quality}
- G06F 2203/04103: Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
- G01L: MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE (weighing G01G)
- G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N)

## Abstract

A sensor includes a base material, a first elastic layer provided on the base material, and a sensor body which is provided on the first elastic layer and includes an electrostatic capacitive sensing part, and the base material and the first elastic layer are bonded such that an area corresponding to the sensing part becomes a non-bonded area.

## Claims

### Claim 1

A sensor comprising:
a base material;
a first elastic layer provided on the base material; and
a sensor body which is provided on the first elastic layer and includes an electrostatic capacitive sensing part, wherein
the base material and the first elastic layer are bonded such that an area corresponding to the sensing part becomes a non-bonded area.

### Claim 2 (depends on 1)

The sensor according to claim 1, wherein
the sensor body includes:
a first reference electrode layer provided on the first elastic layer;
a second reference electrode layer provided apart from the first reference electrode layer;
a sensor electrode layer which is provided between the first reference electrode layer and the second reference electrode layer and includes the sensing part;
a first support layer provided between the first reference electrode layer and the sensor electrode layer; and
a second support layer provided between the second reference electrode layer and the sensor electrode layer.

### Claim 3 (depends on 2)

The sensor according to claim 2, wherein the first elastic layer is configured to be pressed against the sensor body such that the first reference electrode layer can be pushed up toward the sensing part.

### Claim 4 (depends on 2)

The sensor according to claim 2, wherein the first support layer has a first space between the first reference electrode layer and the sensing part, and
the second support layer has a second space between the second reference electrode layer and the sensing part.

### Claim 5 (depends on 4)

The sensor according to claim 4, wherein the sensor body further includes at least one of a first structure which is provided in the first space and is lower than a height of the first support layer and a second structure which is provided in the second space and is lower than a height of the second support layer.

### Claim 6 (depends on 4)

The sensor according to claim 4, wherein the first elastic layer is configured to be pressed against the sensor body such that the first reference electrode layer can be pushed up into the first space.

### Claim 7 (depends on 1)

The sensor according to claim 1, further comprising a second elastic layer having a lower elastic modulus than the first elastic layer, wherein
the base material is provided on the second elastic layer.

### Claim 8 (depends on 7)

The sensor according to claim 7, wherein the base material has a higher elastic modulus than the first elastic layer and the second elastic layer.

### Claim 9 (depends on 1)

The sensor according to claim 1, wherein the first elastic layer contains a foamed resin, an elastomer or a gel.

### Claim 10

A sensor comprising:
a structure;
a spring member provided on the structure;
a support layer provided on the spring member; and
a sensor body which is provided on the support layer and includes an electrostatic capacitive sensing part, wherein
the structure is provided at a position corresponding to the sensing part, and
the support layer has a space at the position corresponding to the sensing part.

### Claim 11 (depends on 1)

An input apparatus comprising:
an exterior body; and
the sensor according to claim 1, wherein
the sensor is provided on an inner surface of the exterior body.

### Claim 12 (depends on 1)

An electronic device comprising:
a housing; and
the sensor according to claim 1, wherein
the sensor is provided on an inner surface of the housing.