# US 2021/0276085 A1 · Metal sintering preparation and the use thereof for the connecting of components

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- Number: US 2021/0276085 A1
- Document ID: US20210276085A1
- Status: Published application
- Kind: A1
- Application number: 17/331,361
- Filed: 2021-05-26
- Published: 2021-09-09
- Earliest claimed: 2014-11-03
- Assignees: Heraeus Deutschland GmbH & Co. KG
- Applicants: Heraeus Deutschland GmbH & Co. KG
- Inventors: Wolfgang SCHMITT; Thomas KREBS; Michael SCHÄFER; Susanne Klaudia DUCH; Jens NACHREINER
- Web page: https://patentgrep.com/patent/US20210276085A1

## CPC

- B22F 3/10: Sintering only
- B22F 1/05: Metallic powder characterised by the size or surface area of the particles
- B22F 1/068: Flake-like particles
- B22F 1/102: Metallic powder coated with organic material
- B22F 7/062: {involving the connection or repairing of preformed parts}
- B22F 7/064: {using an intermediate powder layer}
- B22F 7/08: with one or more parts not made from powder {(B22F7/062 takes precedence)}
- C22C 5/06: Alloys based on silver
- B22F 2301/255: Silver or gold
- C22C 5/00: Alloys based on noble metals
- C22C 9/00: Alloys based on copper
- C22C 21/00: Alloys based on aluminium
- H10W 72/01361: {Chemical or physical modification, e.g. by sintering or anodisation (patterning H10W72/01351)}
- H10W 72/07331: {Connecting techniques}
- H10W 72/325: {Die-attach connectors having a filler embedded in a matrix}
- H10W 72/352: {comprising metals or metalloids, e.g. solders}
- H10W 72/353: {not comprising solid metals or solid metalloids, e.g. ceramics}
- H10W 90/732: {between stacked chips}
- B22F: WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER (making alloys by powder metallurgy C22C); APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- C22C: ALLOYS (treatment of alloys C21D, C22F)
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A metal sintering preparation containing (A) 50 to 90% by weight of at least one metal that is present in the form of particles having a coating that contains at least one organic compound, and (B) 6 to 50% by weight organic solvent. The mathematical product of tamped density and specific surface of the metal particles of component (A) is in the range of 40,000 to 80,000 cm−1.

## Claims

### Claim 1

A metal sintering preparation comprising: (A) 50 to 90% by weight of silver that is present in the form of particles, wherein the particles comprise a coating containing at least one organic compound, (B) 6 to 50% by weight organic solvent, (C) 0 to 12% by weight of at least one metal precursor, (D) 0 to 10% by weight of at least one sintering aid, and (E) 0 to 15% by weight of one or more further ingredients selected from dispersion agents, surfactants, de-foaming agents, binding agents, polymers and/or viscosity-controlling rheological agents,
wherein a mathematical product of tamped density and specific surface of the metal particles of component (A) is in a range of 40,000 to 70,000 cm−1 and wherein at least 70% by weight of the particles are present in the form of flakes.

### Claim 2 (depends on 1)

The metal sintering preparation according to claim 1, wherein the mathematical product of tamped density and specific surface of the metal particles of component (A) is in the range of 50,000 to 70,000 cm−1.

### Claim 3 (depends on 1)

The metal sintering preparation according to claim 1, comprising one, two or more different types of metal particles.

### Claim 4 (depends on 1)

The metal sintering preparation according to claim 1, wherein the at least one organic compound is selected from the group consisting of free fatty acids, fatty acid salts, and fatty acid esters.

### Claim 5 (depends on 1)

A method for the connecting of components comprising (a) providing a sandwich arrangement which comprises at least (a1) one component 1, (a2) one component 2, and (a3) one metal sintering preparation according to claim 1 that is situated between component 1 and component 2, and (b) sintering the sandwich arrangement.

### Claim 6 (depends on 5)

The method according to claim 5, wherein at least one of components 1 and 2 comprises an aluminum contact surface or copper contact surface by which the sandwich arrangement is implemented.

### Claim 7 (depends on 5)

The method according to claim 5, wherein the sintering is performed while applying pressure or without pressure.

### Claim 8 (depends on 5)

The method according to claim 5, wherein the components are parts that are used in electronics.