Display device and method of manufacturing the same

A method for manufacturing a display device, the method comprising:

• forming a base substrate on a carrier substrate, the base substrate including:
• an organic film including a polymeric material;
• and
• an inorganic barrier film overlapping the organic film and extending outwardly from an edge of the organic film;
• forming a first active pattern including a semiconductive material in a display area of the base substrate;
• forming a first interlayer insulation layer on the first active pattern;
• forming a second active pattern on the first interlayer insulation layer in the display area of the base substrate, the second active pattern including a semiconductive material different from the first active pattern;
• forming a second interlayer insulation layer on the second active pattern;
• forming a photoresist film on the second interlayer insulation layer;
• exposing the photoresist film to light through a first mask including:
• a first transmitting portion overlapping the first active pattern or the second active pattern;
• and
• a second transmitting portion disposed between an edge of the carrier substrate and the edge of the organic film;
• exposing an edge portion of the photoresist film to light, the edge portion of the photoresist film overlapping the edge of the carrier substrate;
• developing the photoresist film to form a first photoresist pattern that includes a first opening and does not overlap the edge of the carrier substrate, the first opening overlapping the first active pattern or the second active pattern;
• and
• forming a contact hole exposing the first active pattern or the second active pattern by using the first photoresist pattern as a mask.

A method for manufacturing a display device, the method comprising:

• forming a base substrate on a carrier substrate, the base substrate including:
• an organic film including a polymeric material;
• and
• an inorganic barrier film overlapping the organic film and extending outwardly from an edge of the organic film;
• forming an active pattern including a semiconductive material in a display area of the base substrate;
• forming an interlayer insulation layer including an inorganic material on the active pattern;
• forming a photoresist film on the interlayer insulation layer;
• exposing the photoresist film to light through a first mask including:
• a first transmitting portion overlapping the active pattern;
• and
• a second transmitting portion disposed between an edge of the carrier substrate and the edge of the organic film;
• exposing an edge portion of the photoresist film to light, the edge portion of the photoresist film overlapping the edge of the carrier substrate;
• developing the photoresist film to form a first photoresist pattern that includes a first opening and does not overlap the edge of the carrier substrate, the first opening overlapping the active pattern;
• and
• forming a contact hole exposing the active pattern by using the first photoresist pattern as a mask.