Optoelectronic Component and Method for Producing an Optoelectronic Component

An optoelectronic component comprising:

• a semiconductor chip comprising an electrical contact, the semiconductor chip configured to emit primary electromagnetic radiation;
• a carrier comprising an electrically conductive coating on which the semiconductor chip with the electrical contact is arranged;
• a contact agent connecting the electrically conductive coating of the carrier and the electrical contact of the semiconductor chip with one another;
• and
• a passivation layer arranged in places on the electrically conductive coating,
• wherein an outer surface of the electrically conductive coating is completely encapsulated by the passivation layer and the contact agent,
• wherein the passivation layer has a penetration,
• wherein the contact agent protrudes beyond the penetration in a lateral direction, and
• wherein the semiconductor chip is a flip chip.

A method for producing an optoelectronic component, the method comprising:

• providing a carrier comprising an electrically conductive coating;
• providing a passivation layer on the carrier;
• providing a radiation-emitting semiconductor chip comprising an electrical contact;
• and
• connecting the radiation-emitting semiconductor chip to the carrier by a contact agent,
• wherein an outer surface of the electrically conductive coating is completely encapsulated by the passivation layer and the contact agent,
• wherein the passivation layer has a penetration,
• wherein the contact agent protrudes beyond the penetration in a lateral direction, and
• wherein the radiation-emitting semiconductor chip is a flip chip.