Semiconductor package device and method for manufacturing the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsShao Hsuan CHUANG, Huang-Hsien CHANG, Min Lung HUANG
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Abstract
A semiconductor package device includes a first conductive wall, a second conductive wall, a first insulation wall, a dielectric layer, a first electrode, and a second electrode. The first insulation wall is disposed between the first and second conductive walls. The dielectric layer has a first portion covering a bottom surface of the first conductive wall, a bottom surface of the second conductive wall and a bottom surface of the first insulation wall. The first electrode is electrically connected to the first conductive wall. The second electrode is electrically connected to the second conductive wall.
Claims20
A semiconductor package device, comprising:
- a first conductive wall;
- a second conductive wall;
- a first insulation wall disposed between the first and second conductive walls;
- a dielectric layer having a first portion covering a bottom surface of the first conductive wall, a bottom surface of the second conductive wall and a bottom surface of the first insulation wall;
- a first electrode electrically connected to the first conductive wall;
- and
- a second electrode electrically connected to the second conductive wall.
A semiconductor package device, comprising:
- a first conductive wall;
- a second conductive wall;
- an insulation wall disposed between the first and second conductive walls;
- a dielectric layer covering a top surface of the first conductive wall, a top surface of the second conductive wall and a top surface of the insulation layer;
- a first conductive via penetrating the dielectric layer and in contact with the first conductive wall;
- a second conductive via penetrating the dielectric layer and in contact with the second conductive wall;
- a first electrode electrically connected to the first conductive wall via the first conductive via;
- and
- a second electrode electrically connected to the second conductive wall via the second conductive via.
A method for manufacturing a semiconductor package device, comprising:
- providing a carrier;
- providing a multi-layered structure comprising a plurality of conductive walls wherein every two adjacent conductive walls are separated from each other by an insulation wall disposed between the every two adjacent conductive walls;
- bonding the multi-layered structure on the carrier;
- forming a first electrode electrically connected to one of the every two adjacent conductive walls;
- and
- forming a second electrode electrically connected to the other of the every two adjacent conductive walls.
Dependencies are inferred from the claim text.