Solid-state imaging element and imaging device
AssigneeSony Semiconductor Solutions Corporation
InventorsNAOTO SASAKI, YUTAKA OOKA
Life of this patent
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Abstract
The height of a solid-state imaging element is further reduced as compared to the related art. A solid-state imaging element that is a wafer-level chip size package, including: an optical sensor chip; a protective layer that is stacked on a light receiving surface of the optical sensor chip; and a rewiring layer that is stacked on a surface opposite to the light receiving surface of the optical sensor chip, in which a connection terminal of the rewiring layer is a copper flat pad without a solder ball, an alloy layer of tin and copper is not formed on a front surface of the flat pad, and a thermal expansion coefficient of the protective layer is substantially balanced with a thermal expansion coefficient of the rewiring layer.
Claims8
A solid-state imaging element, comprising:
- an optical sensor chip;
- a color filter;
- an on-chip lens;
- a protective layer on a light receiving surface of the optical sensor chip, wherein the protective layer is a transparent resin layer that covers the color filter and the on-chip lens;
- and
- a rewiring layer on a surface opposite to the light receiving surface of the optical sensor chip, wherein
- a connection terminal of the rewiring layer is a copper flat pad that excludes a solder ball, and
- an alloy layer of tin and copper is absent on a front surface of the copper flat pad.
An imaging device, comprising:
- a solid-state imaging element that is a wafer-level chip size package;
- and
- a signal processing circuit configured to process a signal from the solid-state imaging element, wherein the solid-state imaging element includes:
- an optical sensor chip;
- a color filter;
- an on-chip lens;
- a protective layer on a light receiving surface of the optical sensor chip, wherein the protective layer is a transparent resin layer that covers the color filter and the on-chip lens;
- and
- a rewiring layer on a surface opposite to the light receiving surface of the optical sensor chip, wherein
- a connection terminal of the rewiring layer is a copper flat pad that excludes a solder ball, and
- an alloy layer of tin and copper is absent on a front surface of the copper flat pad.
Dependencies are inferred from the claim text.