Image pickup device, method of manufacturing image pickup device, and electronic apparatus
AssigneeSony Group Corporation
InventorShinya Sato
Life of this patent
Estimating the term…
Abstract
Provided is an image pickup device, including: a first trench provided between a plurality of pixels in a light-receiving region of a semiconductor substrate, the semiconductor substrate including the light-receiving region and a peripheral region, the light-receiving region being provided with the plurality of pixels each including a photoelectric conversion section; and a second trench provided in the peripheral region of the semiconductor substrate, wherein the semiconductor substrate has a variation in thickness between a portion where the first trench is provided and a portion where the second trench is provided.
Claims20
An imaging device comprising:
- a semiconductor substrate comprising a light-receiving region and a peripheral region, the light-receiving region including a photoelectric conversion region;
- a first separation region disposed in the light-receiving region;
- a second separation region disposed in the peripheral region;
- and
- a third separation region disposed in the peripheral region and disposed under the second separation region,
- wherein the third separation region includes a first portion, a second portion, and a third portion in a cross-sectional view,
- wherein the second separation region contacts with the second portion of the third separation region, and
- wherein a width of the first portion is different than a width of the third portion in the cross-sectional view.
An electronic apparatus provided with an image pickup device, the image pickup device comprising:
- a semiconductor substrate including a light-receiving region and a peripheral region, the light-receiving region including a photoelectric conversion region;
- a first separation region disposed in the light-receiving region;
- a second separation region disposed in the peripheral region;
- and
- a third separation region disposed in the peripheral region and disposed under the second separation region,
- wherein the third separation region includes a first portion, a second portion, and a third portion in a cross-sectional view,
- wherein the second separation region contacts with the second portion of the third separation region, and
- wherein a width of the first portion is different than a width of the third portion in the cross-sectional view.
A method of manufacturing an image pickup device, the method comprising:
- providing a semiconductor substrate comprising a light-receiving region and a peripheral region, the light-receiving region including a photoelectric conversion region;
- disposing a first separation region in the light-receiving region;
- disposing a second separation region in the peripheral region;
- and
- disposing a third separation region in the peripheral region and disposed under the second separation region,
- wherein the third separation region includes a first portion, a second portion, and a third portion in a cross-sectional view,
- wherein the second separation region contacts with the second portion of the third separation region, and
- wherein a width of the first portion is different than a width of the third portion in the cross-sectional view.
Dependencies are inferred from the claim text.