Integrated Memory Having Non-Ohmic Devices and Capacitors
AssigneeMicron Technology, Inc.
InventorsPankaj Sharma, Muralikrishnan Balakrishnan
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AssigneeMicron Technology, Inc.
InventorsPankaj Sharma, Muralikrishnan Balakrishnan
Estimating the term…
Some embodiments include a memory cell having a non-ohmic device between a transistor source/drain region and a capacitor. Some embodiments include a memory cell having a transistor with a first source/drain region, a second source/drain region, and a channel region between the first and second source/drain regions. A capacitor is electrically coupled to the second source/drain region through a non-ohmic device. The non-ohmic device includes a non-ohmic-device-material which changes conductivity in response to an electrical property along the channel region. The non-ohmic-device-material has a high-resistivity-mode when the electrical property along the channel region is below a threshold level, and transitions to a low-resistivity-mode when the electrical property along the channel region meets or exceeds the threshold level. Some embodiments include a memory array.
A memory cell comprising a non-ohmic device between a transistor source/drain region and a capacitor, the non-ohmic device being a non-memory element in operation.
A memory cell comprising:
A memory array, comprising:
Dependencies are inferred from the claim text.