Semiconductor package and related methods
AssigneeSemiconductor Components Industries, LLC
InventorsSeungwon IM, Oseob JEON, JoonSeo SON, Mankyo JONG, Olaf ZSCHIESCHANG
Life of this patent
Estimating the term…
Abstract
Implementations of semiconductor packages may include: a first substrate having a first dielectric layer coupled between a first metal layer and a second metal layer; a second substrate having a second dielectric layer coupled between a third metal layer and a fourth metal layer. A first die may be coupled with a first electrical spacer coupled in a space between and coupled with the first substrate and the second substrate and a second die may be coupled with a second electrical spacer coupled in a space between and coupled with the first substrate and the second substrate.
Claims20
A semiconductor package comprising:
- a first substrate;
- a second substrate;
- and
- one or more flexible electrical supports directly coupled to the first substrate and the second substrate.
A semiconductor package comprising:
- a first substrate;
- a second substrate;
- a die coupled between the first substrate and the second substrate;
- and
- one or more flexible electrical supports directly coupled to the first substrate and the second substrate.
A semiconductor package comprising:
- a first substrate;
- a second substrate;
- a die coupled between the first substrate and the second substrate;
- an electrical spacer coupled between the first substrate and the die;
- and
- one or more flexible electrical supports directly coupled to the first substrate and the second substrate.
Dependencies are inferred from the claim text.