Electronic device package
AssigneeIntel Corporation
InventorsZhicheng Ding, Bin Liu, Yong She, Hyoung Il Kim
Life of this patent
Estimating the term…
Abstract
Electronic device package technology is disclosed. An electronic device package in accordance with the present disclosure can include an electronic component, a redistribution layer, and an interposer electrically coupling the redistribution layer and the electronic component. The interposer can have interconnect interfaces on a top side electrically coupled to the electronic component and interconnect interfaces on a bottom side electrically coupled to the redistribution layer. A density of the interconnect interfaces on the top side can be greater than a density of the interconnect interfaces on the bottom side. Associated systems and methods are also disclosed.
Claims37
An electronic device package, comprising:
- an electronic component;
- a redistribution layer;
- and
- an interposer electrically coupling the redistribution layer and the electronic component, the interposer having interconnect interfaces on a top side electrically coupled to the electronic component and interconnect interfaces on a bottom side electrically coupled to the redistribution layer,
- wherein a density of the interconnect interfaces on the top side is greater than a density of the interconnect interfaces on the bottom side.
The electronic device package of claim 0, wherein the interposer and the electronic component are electrically coupled by a wire bond connection.
The electronic device package of claim 0, wherein the mold compound comprises an epoxy.
The electronic device package of claim 0, wherein at least some of the plurality of electronic components are electrically coupled to one another by wire bond connections.
The electronic device package of claim 0, wherein the second electronic component comprises a plurality of second electronic components in a stacked arrangement.
The electronic device package of claim 0, wherein at least some of the plurality of second electronic components are electrically coupled to one another by wire bond connections.
The electronic device package of claim 0, wherein the interconnect structures comprise solder balls.
The electronic device package of claim 0, wherein the integrated circuit comprises an application specific integrated circuit, computer memory, or a combination thereof.
17-52. (canceled)
A method for making an electronic device package, comprising:
- obtaining an interposer having interconnect interfaces on a top side to electrically couple to an electronic component and interconnect interfaces on a bottom side to electrically couple to a redistribution layer, wherein a density of the interconnect interfaces on the top side is greater than a density of the interconnect interfaces on the bottom side;
- and
- supporting the interposer with a temporary carrier.
The method of claim 0, further comprising:
- disposing an adhesive layer on the temporary carrier;
- and
- disposing the interposer on the adhesive layer such that the bottom side of the interposer is in contact with the adhesive layer.
The method of claim 0, further comprising disposing an electronic component on the temporary carrier in contact with the adhesive layer.
The method of claim 0, further comprising electrically coupling the electronic component and the interposer.
57-58. (canceled)
The method of claim 0, further comprising encapsulating the electronic component and the interposer with a mold compound.
(canceled)
The method of claim 0, further comprising removing the temporary carrier and the adhesive layer from a bottom of the mold compound and the interposer.
The method of claim 0, further comprising:
- disposing a redistribution layer on the bottom of the mold compound and the interposer;
- and
- electrically coupling the redistribution layer and the interposer.
The method of claim 0, further comprising disposing solder balls on a bottom of the redistribution layer.
64-70. (canceled)
The method of claim 0, further comprising:
- disposing a redistribution layer on the temporary carrier;
- and
- electrically coupling the redistribution layer and the interposer.
The method of claim 0, further comprising disposing an electronic component on the temporary carrier.
The method of claim 0, further comprising electrically coupling the electronic component and the interposer.
74-75. (canceled)
The method of claim 0, further comprising encapsulating the electronic component and the interposer with a mold compound.
(canceled)
The method of claim 0, further comprising removing the temporary carrier from a bottom of the redistribution layer.
The method of claim 0, further comprising disposing solder balls on a bottom of the redistribution layer.
80-89. (canceled)
Dependencies are inferred from the claim text.