Semiconductor packaging method and semiconductor package device

A semiconductor package device, comprising:

• a chip, wherein the chip includes:
• a chip substrate having a front surface and a back surface, wherein the front surface includes a photosensitive region;
• soldering pads disposed at the front surface of the chip substrate surrounding the photosensitive region;
• a metal part formed on a side of each soldering pad facing away from the chip substrate;
• and
• a transparent protective layer formed on the front surface of the chip substrate, wherein the transparent protective layer covers the photosensitive region of the chip substrate;
• a first end of the metal part away from a corresponding soldering pad is in coplanar with the transparent protective layer;
• and the first end of the metal part is not covered by the transparent protective layer;
• a circuit board, on the back surface of the chip substrate;
• and
• a conductive connection part, which electrically connects a surface of the first end of the metal part, exposed by protruding over a surface of the transparent protective layer, to the circuit board, wherein the chip and the circuit board are electrically connected with each other.