Semiconductor package structures and methods of manufacturing the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsSyu-Tang LIU, Huang-Hsien CHANG, Shu-Han YANG
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Abstract
A semiconductor package structure includes a first substrate, a second substrate, a pad layer and a conductive bonding layer. The first substrate has a first surface and a second surface opposite to the first surface. The second substrate has a first surface and a second surface opposite to the first surface. The second substrate is disposed side-by-side with the first substrate. The pad layer is disposed on the second surface of the first substrate and the second surface of the second substrate. The conductive bonding layer is disposed between the pad layer and the second surfaces of the first substrate and the second substrate.
Claims20
A semiconductor package structure, comprising:
- a first substrate having a first surface and a second surface opposite to the first surface;
- a second substrate having a first surface and a second surface opposite to the first surface wherein the second substrate is disposed side-by-side with the first substrate;
- a pad layer disposed on the second surface of the first substrate and the second surface of the second substrate;
- and
- a conductive bonding layer disposed between the pad layer and the second surfaces of the first substrate and the second substrate.
A semiconductor package structure, comprising:
- a first substrate having a first surface and a second surface opposite to the first surface;
- a second substrate having a first surface and a second surface opposite to the first surface, wherein the second substrate is disposed side-by-side with the first substrate;
- and
- a pad layer,
- wherein the first surface and the second surface of the first substrate and the first surface and the second surface of the second substrate comprise conductive traces, a line width and line space (L/S) of the first surface of the first substrate is less than an L/S of the second surface of the first substrate, and an L/S of the first surface of the second substrate is less than an L/S of the second surface of the second substrate, and
- wherein the pad layer is disposed on the second surface of the first substrate and the second surface of the second substrate and electrically connected to the first substrate and the second substrate.
A method of manufacturing a semiconductor package structure, comprising:
- providing a carrier having a pad layer on the carrier;
- bonding a first substrate and a second substrate to the pad layer;
- and
- providing an encapsulant covering the first substrate and a second substrate.
Dependencies are inferred from the claim text.