Chip package with antenna element

A chip package, comprising:

• a semiconductor die having a conductive element;
• an antenna element over the semiconductor die;
• a conductive feature electrically connecting the conductive element of the semiconductor die and the antenna element;
• and
• a protective layer surrounding the conductive feature, wherein a portion of the antenna element is between the conductive feature and the protective layer.

A chip package, comprising:

• a semiconductor die having a conductive element;
• an antenna element over the semiconductor die;
• a conductive feature electrically connecting the conductive element of the semiconductor die and the antenna element;
• and
• a protective layer surrounding the conductive pin, wherein a bottom surface of the conductive feature is lower than a top surface of the protective layer and higher than a bottom surface of the semiconductor die.