Semiconductor package including a modular side radiating waveguide launcher

A system for forming a semiconductor package side-radiating waveguide launcher, comprising:

• a means for forming a first conductive member proximate an edge of a dielectric medium having a thickness;
• a means for forming a second conductive member proximate the edge of the dielectric medium and transversely opposed across the thickness of the dielectric medium to the first conductive member;
• a means for conductively coupling the first conductive member with the second conductive member using at least one conductive structure forming a shaped space in the dielectric medium;
• the shaped space having a first end and an opposed second end;
• and
• a means for disposing at least one radio frequency (RF) excitation element at a location within the dielectric medium electrically isolated from the first conductive member, the second conductive member, and the conductive structure.

A method of forming a semiconductor package side-radiating waveguide launcher, comprising:

• forming a first conductive member proximate an edge of a dielectric medium having a thickness;
• forming a second conductive member proximate the edge of the dielectric medium and transversely opposed across the thickness of the dielectric medium to the first conductive member;
• conductively coupling the first conductive member with the second conductive member using at least one conductive structure forming a shaped space in the dielectric medium;
• the shaped space having a first end and an opposed second end;
• and
• disposing at least one radio frequency (RF) excitation element at a location within the dielectric medium electrically isolated from the first conductive member, the second conductive member, and the conductive structure.