Semiconductor device and method of manufacturing same
AssigneeAblic Inc.
InventorTakahiro Kato
Life of this patent
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Abstract
A semiconductor element is mounted on a die pad, and electrode pads arranged along the outer circumference of an upper surface of the semiconductor element are electrically connected to leads by wires, respectively. The semiconductor element has an element region having a high sensitivity with respect to stress, and an element region having a relatively low sensitivity with respect to stress. A low-stress resin film is provided on the element region having a high sensitivity with respect to stress. The semiconductor element, the low-stress resin film, the die pad, and the leads are covered with an encapsulating resin.
Claims11
A semiconductor device, comprising:
- a semiconductor element;
- a die pad on which the semiconductor element is placed;
- a lead arranged so as to be spaced apart from the die pad;
- a low-stress resin film provided on an element surface of the semiconductor element;
- and
- an encapsulating resin for covering the semiconductor element, the low-stress resin film, the die pad, and the lead,
- wherein the low-stress resin film has a Young's modulus which is smaller than a Young's modulus of the encapsulating resin, and has a first concave curved surface in a surface of the low-stress resin film opposite to a surface thereof in contact with the semiconductor element.
A method of manufacturing a semiconductor device including:
- a semiconductor element;
- a die pad on which the semiconductor element is placed;
- a lead arranged so as to be spaced apart from the die pad;
- a low-stress resin film provided on an element surface of the semiconductor element;
- and
- an encapsulating resin for covering the semiconductor element, the low-stress resin film, the die pad, and the lead,
- the method comprising:
- preparing the die pad and the lead arranged so as to be spaced apart from the die pad;
- mounting the semiconductor element on the die pad;
- forming, on the element surface of the semiconductor element, the low-stress resin film in which a first back surface is a planar surface and a first main surface opposite to the first back surface is a first concave curved surface;
- and
- forming the encapsulating resin to cover the semiconductor element, the low-stress resin film, the die pad, and the lead.
Dependencies are inferred from the claim text.