Semiconductor device package and method of manufacturing the same

A semiconductor device package, comprising:

• a first electronic component having an active surface;
• a second electronic component connected to the active surface of the first electronic component, the second electronic component having a first surface facing away from the first electronic component, wherein a width of the second electronic component is smaller than a width of the first electronic component;
• an electrical contact disposed on the first surface of the second electronic component;
• and
• a reinforcement layer disposed on the first surface of the second electronic component.

A method of manufacturing a semiconductor device package, comprising:

• (a) providing a plurality of first electronic components each having a TSV fully penetrating the first electronic component;
• (b) forming an electrical contact on a first surface of each first electronic component;
• (c) forming a reinforcement layer on the first surface of each first electronic component;
• and
• (d) performing a singulation operation to separate out individual first electronic components.