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US 2021/0265273 A1Published application
Semiconductor device package and method of manufacturing the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsChien Lin CHANG CHIEN, Chiu-Wen LEE, Ian HU, Chang Chi LEE
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Abstract
A semiconductor device package includes a plurality of semiconductor chips and an interposer structure. The interposer structure has a plurality of tiers for accommodating the plurality of semiconductor chips. The interposer structure includes at least one conductive via connecting to a pad of the plurality of semiconductor chips.
Claims20
A semiconductor device package, comprising:
- a plurality of semiconductor chips;
- and
- an interposer structure having a plurality of tiers for accommodating the plurality of semiconductor chips;
- wherein the interposer structure comprises at least one conductive via connecting to a pad of the plurality of semiconductor chips.
1 more element
A semiconductor device package, comprising:
- a stair-step interconnect structure having a plurality of steps at different elevations;
- and
- a plurality of semiconductor chips disposed on and electrically connected to the plurality of steps of the stair-step interconnect structure,
- wherein the stair-step interconnect structure comprises a silicon-based layer.
1 more element
A method for manufacturing a semiconductor device package, comprising:
- forming a stair-step interconnect structure having a plurality of steps at different elevations;
- and
- disposing a plurality of semiconductor chips on the plurality of steps of the stair-step interconnect structure.
Dependencies are inferred from the claim text.