A method for producing a superconductive connection across a discontinuity between a first superconductive area and a second superconductive area of a superconducting chip, the method comprising using one or more thin film deposition methods to form a strip of superconductive material on top of said first and second superconductive areas and across said discontinuity, so that:
- a first end of said strip is made to comprise a first planar end portion attached to and parallel with said first superconductive area;
- a second end of said strip is made to comprise a second planar end portion attached to and parallel with said second superconductive area;
- said strip is made to comprise a middle portion between said first and second planar end portions;
- said middle portion is made to form a bend away from a plane defined by the surfaces of the first and second superconductive areas, leaving an empty space between said middle portion and said plane;
- and
- at least one of said first and second planar end portions is formed so that a respective separation line that separates that planar end portion from the middle portion is directed otherwise than transversally across said strip.