Flip chip interconnection and circuit board thereof
AssigneeChipbond Technology Corporation
InventorsYu-Chen Ma, Hsin-Hao Huang, Wen-Fu Chou, Gwo-Shyan Sheu
Life of this patent
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Abstract
A flip chip interconnection including a circuit board is disclosed. The circuit board includes a substrate, inner leads, a T-shaped circuit line and a dummy pattern. The inner leads, the T-shaped circuit line and the dummy pattern are located on an inner bonding area of the substrate. The T-shaped circuit line includes a main segment, a branch segment and a connection segment that is connected to the main segment and the branch segment. The main segment and the branch segment are extended along a lateral direction and a longitudinal direction, respectively. The dummy pattern is located between the connection segment and the inner leads.
Claims19
A circuit board, comprising:
- a substrate having a surface, an inner bonding area is defined on the surface and configured to be divided into a first area and a second area, the first area is located outside the second area;
- a plurality of inner leads located on the first area;
- at least one T-shaped circuit line located on the second area and including a main segment, a connection segment and a branch segment, the main segment is connected to the connection segment and extended along a lateral direction, the branch segment is connected to the connection segment and extended toward the first area along a longitudinal direction, wherein the branch segment is configured to be bonded with a bump;
- and
- at least one dummy pattern located between the connection segment and the plurality of inner leads and not electrically connected to the plurality of inner leads and the at least one T-shaped circuit line.
A flip chip interconnection, comprising:
- a circuit board including a substrate, a plurality of inner leads, at least one T-shaped circuit line and at least one dummy pattern, an inner bonding area is defined on a surface of the substrate and configured to be divided into a first area and a second area, the first area is located outside the second area, the plurality of inner leads are located on the first area, the at least one T-shaped circuit line is located on the second area and includes a main segment, a connection segment and a branch segment, the main segment is connected to the connection segment and extended along a lateral direction, the branch segment is connected to the connection segment and extended toward the first area along a longitudinal direction, the at least one dummy pattern is located between the connection segment and the plurality of inner leads and not electrically connected to the plurality of inner leads and the at least one T-shaped circuit line;
- a chip mounted on the inner bonding area and including a plurality of first bumps and at least one second bump;
- and
- a solder layer located between the circuit board and the chip and configured to bond the plurality of first bumps to the plurality of inner leads and bond the at least one second bump to the branch segment.
Dependencies are inferred from the claim text.