Semiconductor package

A semiconductor package, comprising:

• a redistribution substrate including a redistribution layer;
• a semiconductor chip on the redistribution substrate, and having a contact pad electrically connected to the redistribution layer;
• a core member on the redistribution substrate, the core member having a protruding portion that protrudes from an external side surface and having a through-hole accommodating the semiconductor chip, wherein an area defined by the external side surface is smaller than an area of the redistribution substrate;
• and
• an encapsulant on the redistribution substrate, covering the semiconductor chip and the core member, and having a side surface to which a surface of the protruding portion is exposed.

A semiconductor package, comprising:

• a redistribution substrate having a first surface and a second surface opposing each other, and including an insulating member and a redistribution layer on the insulating member, the redistribution layer having a plurality of redistribution patterns that are respectively disposed on a plurality of levels of the insulating member, and having a plurality of redistribution vias that are respectively connected to the plurality of redistribution patterns;
• a core member on the first surface of the redistribution substrate, the core member having a metal frame that includes a through-hole and an external side surface that has a protruding portion, and having a plating layer having a surface roughness (Ra) of 0.5 μm or more on a surface of the metal frame, an area of the core member surrounded by the external side surface of the core member being smaller than an area of the redistribution substrate;
• a semiconductor chip on the first surface of the redistribution substrate in the through-hole, and having a contact pad electrically connected to the redistribution layer by a redistribution via, adjacent to the first surface of the redistribution substrate;
• an encapsulant on the first surface of the redistribution substrate, covering the semiconductor chip and the core member, the encapsulant including an insulating resin that is different from the insulating resin of the insulating member, and having a side surface to which a surface of the protruding portion is exposed;
• and
• an underbump metal on the second surface of the redistribution substrate, and electrically connected to the redistribution layer,
• wherein the protruding portion has an upper surface extending from the upper surface of the core member to be flat and a lower surface recessed from the lower surface of the core member.