Device Carrier Configured for Interconnects, a Package Implementing a Device Carrier Having Interconnects, and Processes of Making the Same

A device, comprising:

• a surface mount device carrier configured to be mounted to a metal submount of a transistor package, said surface mount device carrier comprising an insulating substrate comprising a top surface and a bottom surface and a first pad and a second pad arranged on a top surface of said surface mount device carrier;
• at least one surface mount device comprising a first terminal and a second terminal, said first terminal of said surface mount device mounted to said first pad and said second terminal mounted to said second pad;
• and
• at least one of the first terminal and the second terminal being configured to be isolated from the metal submount by said insulating substrate,
• wherein at least one of the first pad and the second pad are configured as wire bond pads.

A process for implementing an RF transistor package, comprising,

• providing a metal submount;
• mounting a transistor die to said metal submount;
• mounting a surface mount device carrier to said metal submount, said surface mount device carrier comprising an insulating substrate comprising a top surface and a bottom surface and a first pad and a second pad arranged on a top surface of said surface mount device carrier;
• providing a first terminal and a second terminal on a surface mount device;
• mounting said first terminal of said surface mount device to said first pad and said second terminal of said surface mount device to said second pad;
• configuring at least one of the first terminal and the second terminal to be isolated from the metal submount by said insulating substrate;
• and
• bonding at least one wire bond to the at least one of the first pad and the second pad.