Housings for semiconductor packages and related methods
AssigneeSemiconductor Components Industries, LLC
InventorsYushuang YAO, Qing YANG, Lihu HOU
Life of this patent
Estimating the term…
Abstract
A casing for semiconductor packages that includes a plurality of press-fit pins is disclosed. Specific implementations include a shaft including a first end and a second end. The first end may include a head. The press-fit pin may include a bonding portion included at the second end. The bonding portion may include a first section extending substantially perpendicular from a longest length of the shaft. The bonding portion may also include an angled section coupled to a bonding foot. The bonding foot may be configured to be ultrasonically welded to a substrate.
Claims20
A press-fit pin for a semiconductor package, comprising:
- a shaft comprising a first end and a second end, the first end comprising a head;
- a bonding portion comprised at the second end, the bonding portion comprising a first section extending substantially perpendicular from a longest length of the shaft, the bonding portion further comprising an angled section coupled to a bonding foot;
- wherein the bonding foot is configured to be ultrasonically welded to a substrate.
A housing for a semiconductor package, comprising:
- a casing;
- and
- a plurality of connectors extending from the casing;
- and
- a plurality of press-fit pins extending from the casing;
- wherein the plurality of press-fit pins and the plurality of connectors are molded into the casing;
- and
- wherein the plurality of press-fit pins and at least a portion of each of the plurality of connectors are configured to be ultrasonically welded to a substrate.
A method of forming a housing for a semiconductor package, comprising:
- molding a plurality of press-fit pins into a casing;
- placing the casing over a substrate;
- and
- ultrasonically bonding the plurality of press-fit pins to the substrate.
Dependencies are inferred from the claim text.