Flip chip self-alignment features for substrate and leadframe applications

A method of manufacturing an electronic device, the method comprising:

• placing a plurality of bumps of a semiconductor die on a top side of a plurality of bond fingers of a metal leadframe, wherein:
• each of the plurality of bumps comprises a metal pillar and a solder cap,
• each of at least two of the plurality of bond fingers comprises a curved sidewall recessed self-alignment feature, and
• each of the curved sidewall recessed self-alignment feature comprises a maximum width at a top end positioned toward the semiconductor die and a minimum width at a bottom end positioned away from the semiconductor die;
• and
• performing a mass reflow process, thereby melting the solder cap of each of the plurality of bumps, wherein:
• at least one of the plurality of bumps is configured to be pulled into a respective one of the curved sidewall recessed self-alignment feature to align the plurality of bumps to the plurality of bond fingers, and
• a continuous bond is formed between the at least one of the plurality of bumps and the respective one of the curved sidewall recessed self-alignment feature that entirely laterally surrounds a portion of the at least one of the bumps.

An electronic device comprising:

• a metal leadframe comprising a plurality of bond fingers, wherein:
• each of at least two of the plurality of bond fingers comprises a curved sidewall recessed self-alignment feature, and
• each of the curved sidewall recessed self-alignment feature comprises a maximum width at a top end and a minimum width at a bottom end;
• and
• a semiconductor die bonded to a top side of the metal leadframe and comprising a plurality of bumps, wherein:
• each of the plurality of bumps comprises a metal pillar, and
• each of the plurality of bumps is soldered to a respective one of the curved sidewall recessed self-alignment feature thereby providing a continuous bond that entirely laterally surrounds a portion of each the plurality of bumps.

An electronic device comprising:

• a metal leadframe comprising a plurality of bond fingers, wherein:
• each of at least two of the plurality of bond fingers comprises a curved sidewall recessed self-alignment feature with no flat surfaces, and
• each of the curved sidewall recessed self-alignment feature is elliptical-shaped in a top-down view;
• and
• a semiconductor die bonded to a top side of the metal leadframe and comprising a plurality of bumps, wherein:
• each of the plurality of bumps comprises a metal pillar, and
• each of the plurality of bumps is soldered to a respective one of the curved sidewall recessed self-alignment feature thereby providing a continuous bond that entirely laterally surrounds a portion of each the plurality of bumps.