Packaged Electronic Device With Film Isolated Power Stack

A method, comprising:

• forming a first recess in a first side of a first conductive plate;
• forming a first conductive epoxy on a first bottom of the first recess;
• attaching a first side of a first semiconductor die to the first conductive epoxy to electrically couple the first side of the first semiconductor die to the first bottom of the first recess of the first conductive plate;
• forming a first intermediate conductive epoxy on a second side of the first semiconductor die;
• forming a second recess in a first side of a second conductive plate;
• forming a second conductive epoxy on a second bottom of the second recess;
• attaching a first side of a second semiconductor die to the second conductive epoxy to electrically couple the first side of the second semiconductor die to the second bottom of the second recess of the second conductive plate;
• attaching a second side of the second conductive plate to the first intermediate conductive epoxy to electrically couple the second side of the second conductive plate to the second side of the first semiconductor die;
• forming a second intermediate conductive epoxy on a second side of the second semiconductor die;
• attaching a first side of a third conductive plate to the second intermediate conductive epoxy to electrically couple the first side of the third conductive plate to the second side of the second semiconductor die;
• and
• performing a molding process that forms a package structure that encloses the first semiconductor die, and the second semiconductor die, the package structure including a side that exposes a portion of the second side of the first conductive plate.

A method of making a packaged electronic device, comprising:

• providing a first conductive plate, including a first side, an opposite second side, and a first recess in the first side of the first conductive plate, the first recess including a first bottom;
• providing a first semiconductor die, including a first side, and an opposite second side, the first side of the first semiconductor die electrically coupled to the first bottom of the first recess of the first conductive plate;
• providing a second conductive plate, including a first side, an opposite second side, and a second recess in the first side of the second conductive plate, the second recess including a second bottom, the second side of the second conductive plate electrically coupled to the second side of the first semiconductor die;
• providing a second semiconductor die, including a first side, and an opposite second side, the first side of the second semiconductor die electrically coupled to the second bottom of the second recess of the second conductive plate;
• providing a third conductive plate, including a first side electrically coupled to the second side of the second semiconductor die;
• and
• providing a package structure that encloses the first semiconductor die, and the second semiconductor die, the package structure including a side that exposes a portion of the second side of the first conductive plate.

A method for making a packaged switching circuit, comprising:

• providing a first semiconductor die, including:
• a first transistor, including:
• a first source terminal, a first drain terminal, and a first gate terminal,
• a first side electrically coupled to the first source terminal and to a first bottom of a first recess of a first conductive plate, and
• an opposite second side electrically coupled to the first drain terminal and to a second conductive plate;
• providing a second semiconductor die, including:
• a second transistor, including:
• a second source terminal, a second drain terminal, and a second gate terminal,
• a first side electrically coupled to the second source terminal and to a second bottom of a second recess of the second conductive plate, and
• an opposite second side, the second side of the second semiconductor die electrically coupled to the second drain terminal and to a first side of a third conductive plate;
• electrically coupling a first conductive pad to the third conductive plate;
• electrically coupling a second conductive pad to the second conductive plate;
• electrically coupling a third conductive pad to the first gate terminal;
• electrically coupling a fourth conductive pad to the second gate terminal;
• and
• providing a package structure that encloses the first semiconductor die, and the second semiconductor die, the package structure including a side that exposes respective portions of:
• the first conductive pad, the second conductive pad, the third conductive pad, the fourth conductive pad, and the second side of the first conductive plate.