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US 2021/0265245 A1Published application
Lead frame for improving adhesive fillets on semiconductor die corners
AssigneeSTMicroelectronics S.r.l.
InventorsRennier RODRIGUEZ, Maiden Grace MAMING, Jefferson TALLEDO
Life of this patent
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Abstract
The present disclosure is directed to a lead frame including a die pad with cavities, and methods for attaching a semiconductor die to the lead frame. The cavities allow for additional adhesive to be formed on the die pad at the corners of the semiconductor die, and prevent the additional adhesive from overflowing on to active areas of the semiconductor die.
Claims20
A method, comprising:
- forming adhesive on a surface of a die pad, and in a plurality of cavities that extend in to the surface of the die pad;
- and
- positioning a die on the adhesive, the die including a plurality of corners, each of the plurality of corners overlying a respective cavity of the plurality of cavities.
A method, comprising:
- dispensing adhesive on a surface of a die pad, the die pad including a first dimple, a second dimple, a third dimple, and a fourth dimple extending into the surface of the die pad, the first dimple being aligned with the second dimple in a first direction and aligned with the third dimple in a second direction transverse to the first direction, the second dimple being aligned with the fourth dimple in the second direction, the third dimple being aligned with the fourth dimple in the first direction, the surface of the die pad being continuous except for the first, second, third, and fourth dimples;
- and
- positioning a die on the adhesive.
A device, comprising:
- a die pad including:
- a surface;
- and
- first, second, third, and fourth cavities extending in to the surface, the first and second cavities being aligned with each other in a first direction, the third and fourth cavities being aligned with each other in the first direction, the first and third cavities being aligned with each other in a second direction that is transverse to the first direction, the second and fourth cavities being aligned with each other in the second direction, each of the first, second, third, and fourth cavities having an L shape with a first portion extending in the first direction and a second portion extending in the second direction, the surface of the die pad being continuous except for the first, second, third, and fourth cavities;
- and
- a plurality of leads surrounding the die pad.
3 more elements
Dependencies are inferred from the claim text.