Electronic package structure

An electronic package structure, comprising:

• a substrate comprising:
• leads laterally spaced apart from each other with each lead having a lead top surface and an opposing lead bottom surface;
• and
• a substrate encapsulant interposed between the leads, wherein the substrate encapsulant has a substrate top surface and an opposing substrate bottom surface;
• and
• an electronic device coupled to the leads, wherein:
• at least one lead comprises:
• a first lead portion exposed to the outside of the substrate bottom surface and defining a first connection point for attaching the electronic package structure to a next level of assembly;
• and
• a second lead portion laterally extending towards the die pad and having a recessed bottom surface encapsulated by the substrate encapsulant, the second lead portion defining a second connection point for attaching to the electronic device, wherein the first connection point is laterally separated from the second connection point, wherein a conductive structure on the electronic die is attached to the second lead portion at the second connection point, and wherein the electronic device overlaps the second connection point but not the first connection point.

A method for forming an electronic package structure, comprising:

• providing a substrate comprising:
• conductive members laterally spaced apart each other, each conductive member having a conductive member top surface and an opposing conductive member bottom surface;
• and
• a substrate encapsulant interposed between the conductive members, wherein the substrate encapsulant has a substrate top surface and an opposing substrate bottom surface;
• and
• coupling an electronic device to the conductive members, wherein:
• the conductive members include a first conductive member comprising:
• a first part exposed to the outside of the substrate bottom surface and defining a first connection point for attaching the electronic package structure to a next level of assembly;
• and
• a second part laterally extending towards the electronic device and having a recessed bottom surface encapsulated by the substrate encapsulant, the second part defining a second connection point for attaching to the electronic device, wherein the first connection point is laterally separated from the second connection point, wherein a conductive structure on the electronic device is attached to the second part at the second connection point, and wherein the electronic device overlaps the second connection point but not the first connection point.