Cooling apparatus, semiconductor module, and vehicle

A semiconductor module comprising a cooling apparatus and a semiconductor device, wherein

• the semiconductor device includes a semiconductor chip,
• the cooling apparatus includes:
• a top plate having an upper surface and a lower surface, the semiconductor chip being arranged above the upper surface;
• a casing portion having a coolant circulation portion and an outer edge portion surrounding the coolant circulation portion, the coolant circulation portion being arranged under the lower surface of the top plate, and the casing portion being closely attached, directly or indirectly, to the lower surface of the top plate at the outer edge portion;
• and
• a cooling fin arranged in the coolant circulation portion,
• the coolant circulation portion has a first coolant flow channel and a second coolant flow channel arranged, when seen from above in a perpendicular direction to the lower surface of the top plate, so as to sandwich therebetween a fin region in which the cooling fin is provided, and each having two ends in a longitudinal direction,
• the casing portion includes:
• a first opening provided on an end side corresponding to a first end of the first coolant flow channel, and to let a coolant in to or out of the first coolant flow channel;
• and
• a second opening provided on an end side corresponding to a second end of the second coolant flow channel, the second end and the first end being arranged on the same side of the casing portion, and the second opening to let a coolant in to or out of the second coolant flow channel,
• the first coolant flow channel and the second coolant flow channel are each at least partly provided below the cooling fin,
• the first coolant flow channel and the second coolant flow channel each have a flow channel bottom surface, and
• each flow channel bottom surface has an inclined portion, and a distance between a position on the inclined portion and the cooling fin in a depth direction perpendicular to the lower surface of the top plate decreases as a distance between the position on the inclined portion and a center of the fin region in a width direction parallel to the lower surface of the top plate and perpendicular to the longitudinal direction decreases.