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US 2021/0265238 A1Published application
Carbon based polymer thermal interface materials with polymer chain to carbon based fill particle bonds
AssigneeIntel Corporation
InventorsMarely E. Tejeda Ferrari, Taylor Gaines, Elah Bozorg-Grayeli, James C. Matayabas, JR.
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Abstract
Microelectronic devices, assemblies, and systems include a microelectronic die and composite material to conduct heat from the microelectronic die such that the composite material includes polymer chains chemically bonded to fill particles having a hexagonal lattice of carbon atoms such as graphene sheet fill particles and/or carbon nanotube fill particles.
Claims20
A microelectronic device, comprising:
- a microelectronic die;
- and
- a composite material to conduct heat from the microelectronic die, the composite material comprising a polymer chain chemically bonded to a fill particle comprising a hexagonal lattice of carbon atoms.
A system, comprising:
- a microelectronic die;
- a heat spreader having a first surface adjacent the microelectronic die and a second surface opposite the microelectronic die;
- and
- a composite material on one of the first surface or the second surface, the composite material comprising a polymer chain chemically bonded to a fill particle comprising a hexagonal lattice of carbon atoms.
1 more element
A method, comprising:
- applying a composite material over a microelectronic die, the composite material comprising a plurality of fill particles and a plurality of polymer chains, each of the plurality of fill particles comprising a hexagonal lattice of carbon atoms and one or more functional groups;
- and
- curing the composite material to chemically bond at least a first polymer chain of the plurality of polymer chains to at least a first fill particle of the plurality of fill particles via a first functional group of the first fill particle.
Dependencies are inferred from the claim text.