Double-sided cooling type power module

A double-sided cooling type power module, comprising:

• an upper substrate comprising a first insulating layer, a first upper metal layer bonded to a top of the first insulating layer, and a first lower metal layer bonded to a bottom of the first insulating layer;
• a lower substrate disposed under the upper substrate and comprising a second insulating layer, a second upper metal layer bonded to a top of the second insulating layer, and a second lower metal layer bonded to a bottom of the second insulating layer;
• a spacer disposed between the upper substrate and the lower substrate and electrically connecting the upper substrate and the lower substrate;
• and
• a semiconductor chip disposed between the spacer and the upper substrate or between the spacer and the lower substrate,
• wherein the insulating layers comprises a material of which a coefficient of thermal expansion is about 0.8 times or greater and about 1.2 times or less of coefficients of thermal expansion of the metal layers of the upper substrate and the lower substrate.