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US 2021/0265232 A1Published application
Semiconductor device
AssigneeMitsubishi Electric Corporation
InventorJunya SAKAI
Life of this patent
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Abstract
A semiconductor device includes: a base plate having a heat dissipation surface and a mounting surface opposite to each other; a semiconductor chip mounted on the mounting surface of the base plate; a sealing material sealing the semiconductor chip; a first sheet adhering to the heat dissipation surface of the base plate and having plural openings; and a second sheet covering the first sheet.
Claims20
A semiconductor device comprising:
- a base plate having a heat dissipation surface and a mounting surface opposite to each other;
- a semiconductor chip mounted on the mounting surface of the base plate;
- a sealing material sealing the semiconductor chip;
- a first sheet adhering to the heat dissipation surface of the base plate and having plural openings;
- and
- a second sheet covering the first sheet.
3 more elements
Dependencies are inferred from the claim text.