Semiconductor device package including thermal dissipation element and method of manufacturing the same

A semiconductor device package, comprising:

• a first electronic component including a plurality of through vias;
• a second electronic component disposed on the first electronic component;
• and
• a first thermal dissipation element including a first portion disposed between the first electronic component and the second electronic component, and a second portion connected to the first portion and extending through the first electronic component,
• wherein the first thermal dissipation element is electrically floated from the plurality of through vias.

A method of manufacturing a semiconductor device package, comprising:

• providing a first die and at least one second die;
• and
• forming a thermal dissipation element between the first die and the at least second die,
• wherein the thermal dissipation element includes a first portion disposed between the first die and the at least one second die, and a second portion protruding from the first portion, and wherein the thermal dissipation element is electrically floated from the second die.