Semiconductor package with improved clamp
AssigneeLittelfuse Semiconductor (Wuxi) Co., Ltd.
InventorsYong Ai Ong, Chuyao Tai
Life of this patent
Estimating the term…
Abstract
Provided herein are semiconductor packages with improved clamps. In some embodiments, a semiconductor package may include a housing having a wall extending from a main body, and a set of support walls extending from the wall. The semiconductor package may further include a clamp extending between the set of support walls, the clamp having a first planar section coupled to a first support wall of the set of support walls, a second planar section coupled to a second support wall of the set of support walls, and a third planar section between the first and second planar sections. The third planar section may include an opening operable to receive a fastener, and a plurality of stress relief openings.
Claims22
A semiconductor package, comprising:
- a housing, comprising:
- a wall extending from a main body;
- and
- a set of support walls extending from the wall;
- and
- a clamp extending between the set of support walls, the clamp comprising:
- a first planar section coupled to a first support wall of the set of support walls;
- a second planar section coupled to a second support wall of the set of support walls;
- and
- a third planar section between the first and second planar sections, the third planar section including an opening operable to receive a fastener, and a plurality of stress relief openings.
A power semiconductor package, comprising:
- a housing, comprising:
- a wall extending from a main body;
- and
- a first set of support walls and a second set of support walls extending from the wall;
- and
- a first clamp extending between the first set of support walls and a second clamp extending between the second set of support walls, each of the first and second clamps comprising:
- a first planar section coupled to a first support wall of the set of support walls;
- a second planar section coupled to a second support wall of the set of support walls;
- and
- a third planar section between the first and second planar sections, the third planar section including an opening operable to receive a fastener, and a plurality of stress relief openings.
An assembly, comprising:
- a heatsink;
- a power semiconductor module coupled to the heatsink, the power semiconductor module comprising:
- a housing including a wall extending from a main body and a set of support walls extending from the wall;
- and
- a clamp extending between the set of support walls, the clamp comprising:
- a first planar section coupled to a first support wall of the set of support walls;
- a second planar section coupled to a second support wall of the set of support walls;
- and
- a third planar section between the first and second planar sections, the third planar section including an opening operable to receive a fastener, and a plurality of stress relief openings.
Dependencies are inferred from the claim text.