Structures for bonding elements
AssigneeInvensas Bonding Technologies, Inc.
InventorsRajesh Katkar, Laura Wills Mirkarimi, Bongsub Lee, Gaius Gillman Fountain, Jr., Cyprian Emeka Uzoh
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Abstract
A bonded structure is disclosed. The bonded structure includes a first element and a second element that is bonded to the first element along a bonding interface. The bonding interface has an elongate conductive interface feature and a nonconductive interface feature. The bonded structure also includes an integrated device that is coupled to or formed with the first element or the second element. The elongate conductive interface feature has a recess through a portion of a thickness of the elongate conductive interface feature. A portion of the nonconductive interface feature is disposed in the recess.
Claims16
A bonded structure comprising:
- a first element comprising a first conductive interface feature and a first nonconductive interface feature;
- and
- a second element comprising a second conductive interface feature and a second nonconductive interface feature, the second conductive interface feature bonded to the first conductive interface feature along a bonding interface and the second nonconductive interface feature bonded to the first nonconductive interface feature along the bonding interface,
- wherein a first cross-section of the first conductive interface feature taken along a lateral dimension of the first conductive interface feature has a first overall thickness along a vertical dimension transverse to the lateral dimension,
- wherein a second cross-section of the first conductive interface feature along the lateral dimension of the first conductive feature has a second overall thickness along the vertical dimension, the first overall thickness different from the second overall thickness, and
- wherein the first conductive interface feature has a back side opposite the bonding interface, the nonconductive interface feature disposed over the back side of the first conductive interface feature.
A method of forming an apparatus, the method comprising:
- forming a first element comprising a first elongate conductive interface feature and a first nonconductive interface feature;
- forming a second element comprising a second elongate conductive interface feature and a second nonconductive interface feature;
- and
- bonding the first and second elements along a bonding interface, the bonding interface comprising the first and second elongate conductive interface features and the first and second nonconductive interface features;
- wherein the first elongate conductive interface structure is formed over a nonconductive post in the first element.
A semiconductor element comprising:
- a first elongate conductive layer embedded in a non-conductive layer, the first elongate conductive layer having a thickness that varies along its length;
- a second elongate conductive layer embedded in the non-conductive layer;
- and
- an integrated device, the first and second elongate conductive layers disposed around the integrated device,
- wherein the first and second elongate conductive layers comprise a maze-like structure including a plurality of turns.
Dependencies are inferred from the claim text.