Wafer processing method

A wafer processing method for dividing a wafer having devices formed on a front side thereof into individual device chips, the front side being partitioned by a plurality of crossing division lines having a testing metal pattern formed in part thereof into a plurality of regions where the respective devices are formed, the testing metal pattern being connected to a circuit information section, the wafer processing method comprising:

• a wafer holding step of holding the wafer having the devices formed thereon on a chuck table such that the front side of the wafer is in contact with the chuck table and a back side of the wafer is exposed;
• a first modified layer forming step of applying a laser beam of a wavelength having a transmitting property to the wafer with a focal point of the laser beam positioned inside the wafer at a first depth from the back side, thereby forming a first modified layer along a division line;
• a second modified layer forming step of applying, after the first modified layer forming step is performed, the laser beam with the focal point thereof positioned at a second depth shallower than the first depth from the back side of the wafer, thereby forming a second modified layer along the division line;
• and
• a dividing step of applying an external force to the wafer after the first and second modified layer forming steps are performed, thereby dividing the wafer into individual device chips with the first and second modified layers formed inside the wafer along the division line as a division starting point,
• wherein, in the second modified layer forming step, the laser beam is applied with the focal point positioned at a position where the focal point partially overlaps the first modified layer that has been formed, so that the laser beam applied in the second modified layer forming step is scattered by the first modified layer, thereby destroying the circuit information section connected to the testing metal pattern.